Texas Instruments DRV8412DDWR
DRV8412DDWR
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Texas Instruments DRV8412DDWR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
44-TSSOP (0.244, 6.20mm Width) Exposed Pad
Number of Pins
44
Operating Temperature
-40°C~150°C TJ
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Feature
Status Flag
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
44
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Applications
DC Motors, Stepper Motors
Subcategory
Motion Control Electronics
Technology
Power MOSFET
Voltage - Supply
10.8V~13.2V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
2
Supply Voltage
50V
Terminal Pitch
0.635mm
Frequency
500kHz
Base Part Number
DRV8412
Pin Count
44
Number of Outputs
2
Output Voltage
200mV
Max Output Current
6A
Operating Supply Voltage
50V
Interface
PWM
Analog IC - Other Type
STEPPER MOTOR CONTROLLER
Nominal Supply Current
9mA
Output Configuration
Half Bridge (4)
Output Current
14A
Output Current per Channel
3A
Voltage - Load
0V~52.5V
Fault Protection
Current Limiting, Over Temperature, Short Circuit, UVLO
Rds On (Typ)
110m Ω LS, 110m Ω HS
Load Type
Inductive
Height
1.2mm
Length
14mm
Width
6.1mm
Thickness
1.5mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Assembly/Origin :
DRV8412DDWR Overview
Packaged using Tape & Reel (TR).For cost-saving purposes, H bridge is included in the 44-TSSOP (0.244, 6.20mm Width) Exposed Pad package.The supply voltage 10.8V~13.2V has the capabilbridge drivery of improving reliabilbridge drivery.H bridge circuit is put into place according to the way of Surface Mount.When -40°C~150°C TJ is operating at a certain temperature, motor driver H bridge can function normally.H bridge motor driver can be used for a variety of purposes, including DC Motors, Stepper Motors.Using Surface Mount, the board is mounted.Status Flag is one of full bridges specific characteristics.A transmission line is terminated with a H bridge that matches its characteristic impedance, referred to as a 44 termination.Signal interfaces include 44 pins that serve as pronged contacts.The base H bridge ic number of DRV8412 allows you to find more related H bridge ics by using that number.H bridge circuit operates on a voltage of 50V.STEPPER MOTOR CONTROLLER has been incorporated as H bridge circuit's analog IC type.An ambient temperature of 6A determines the maximum load current that a power supply can deliver.The output pins and the power supply pins are conducting 14A current.It is through 44 pins that this bridge driver is able to perform its specific functions.There is a 2 output on it.As part of the Motion Control Electronics subcategory, this H bridge motor driver has various similarities to other parts in this category.In order to maintain a high level of efficiency, the operating supply voltage is maintained at 50V.Hbridge 200mV releases voltage.
DRV8412DDWR Features
Available in 44-TSSOP (0.244, 6.20mm Width) Exposed Pad Package / Case
Operating Temperature at the range of Surface Mount
Interface IC Type : DRV8412
Number of Receivers: 50V
DRV8412DDWR Applications
There are a lot of Texas Instruments DRV8412DDWR Full Bridge Drivers, Half-Bridge Drivers applications.
- Industrial Fans
- Voltage Regulators for CPUs
- VTR
- Optical disc drives
- Voltage Regulators for GPUs
- Notebook Computers
- Compact Blade Servers
- V-Core
- Industrial Pumps
- Telecom Microprocessor
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSupply VoltageRoHS StatusWidthTerminal PositionTerminal FormMounting TypeView Compare
DRV8412DDWR
NA44-TSSOP (0.244, 6.20mm Width) Exposed Pad
44
50 V
ROHS3 Compliant
6.1 mm
DUAL
GULL WING
Surface Mount
TAS5612LADDVRNA44-TSSOP (0.244, 6.20mm Width) Exposed Pad
44
-
ROHS3 Compliant
6.1 mm
DUAL
GULL WING
Surface Mount
DRV8412DDWR
VS
TAS5612LADDVR
- TAS5132DDVNA
44-TSSOP (0.244, 6.20mm Width) Exposed Pad
44
-
ROHS3 Compliant
6.1 mm
DUAL
GULL WING
Surface Mount
DRV8412DDWR
VS
TAS5132DDV
- TAS5342LADDVRNA
44-TSSOP (0.244, 6.20mm Width) Exposed Pad
44
-
ROHS3 Compliant
6.1 mm
DUAL
GULL WING
Surface Mount
DRV8412DDWR
VS
TAS5342LADDVR
TDA8932BTW/N2,118NXP USA Inc.32-TSSOP (0.240, 6.10mm Width) Exposed Pad
-
-
ROHS3 Compliant
6.1 mm
DUAL
GULL WING
Surface Mount
DRV8412DDWR
VS
TDA8932BTW/N2,118
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s DRV8412DDWR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
