ON Semiconductor MC14066BDR2G
MC14066BDR2G
ON Semiconductor MC14066BDR2G information
Type
Parameter
Factory Lead Time
51 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Tin
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Number of Pins
14
Operating Temperature
-55°C~125°C
Packaging
Tape & Reel (TR)
Published
2006
Series
4000B
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
ECCN Code
EAR99
Type
Bilateral, FET Switches
Resistance
1.05kOhm
Subcategory
Multiplexer or Switches
Max Power Dissipation
500mW
Technology
CMOS
Voltage - Supply
3V~18V
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
4
Supply Voltage
5V
Terminal Pitch
1.27mm
Reflow Temperature-Max (s)
40
Base Part Number
4066
Pin Count
14
Circuit
1 x 1:1
Polarity
Non-Inverting
Supply Voltage-Max (Vsup)
18V
Power Supplies
5/15V
Supply Voltage-Min (Vsup)
3V
Number of Channels
4
Nominal Supply Current
15nA
Power Dissipation
500mW
Throw Configuration
SPST
Propagation Delay
40 ns
Turn On Delay Time
120 ns
Halogen Free
Halogen Free
Supply Type
Dual
Bandwidth
65MHz
Turn-Off Delay Time
80 ns
High Level Output Current
25mA
Low Level Output Current
25mA
Off-state Isolation-Nom
50 dB
Voltage Supply Source
Dual Supply
On-state Resistance Match-Nom
25Ohm
Normal Position
NO
Height
1.5mm
Length
8.75mm
Width
4mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
onsemiconductor-mc14066bdg-datasheets-4228.pdf
onsemiconductor-mc14066bdr2g-datasheets-1285.pdf
onsemiconductor-mc14066bdr2g-datasheets-1286.pdf
onsemiconductor-mc14066bdr2g-datasheets-1287.pdf
onsemiconductor-mc14066bdr2g-datasheets-1288.pdf
- Environmental Information :
onsemiconductor-mc14066bdr2g-environmentalinformation-5338.pdf
- RohsStatement :
MC14066BDR2G Overview
In order to conserve board space, digital switch is included in the 14-SOIC (0.154, 3.90mm Width).As a result, it is packaged in a way that is referred to as Tape & Reel (TR).The method digital switch ic adopts for mounting is Surface Mount.the multiplexers uses an analog IC Bilateral, FET Switches.Turn signal switch will not be susceptible to the external factors when the operating temperature is kept at -55°C~125°C.The turn signal switch is designed for use with a 3V~18V supply voltage, which gives it a lot of flexibility.Multiplexers in the 4000B series are suitable for a wide range of applications.As parts of its basic configuration, 14 terminations are desgined.The base part number is 4066, which can also be used to find its logic switch related parts.The multiplexer's system is supplied with a voltage of 5V.There are 14 component pins in this turn signal switch.It is the end of conductors that is represented by GULL WING.Dual is used as its supply type.With 14 pins, it is configured.Vsup should be kept at 3V to prevent some unnecessary failures.To avoid some unnecessary failures, the maximum supply voltage (Vsup) should be kept at 18V.There is a power supply provided for the mux switch's normal operation of 5/15V.This is an the digital switch ic that is classified as Multiplexer or Switches.This signal switching operates at a resistance of 1.05kOhm.There are a total of 4 channels used for transmitting data in the turn signal switch's circuit.
MC14066BDR2G Features
Supplied in the 14-SOIC (0.154, 3.90mm Width) package
Adopting a supply type of Dual
Power supplies of 5/15V
MC14066BDR2G Applications
There are a lot of ON Semiconductor MC14066BDR2G Signal Switches / Multiplexers / Decoders applications.
- HDMI applications
- To select different task for memory in microprocessor memory systems
- Communication system
- Computer memory
- Automatic health monitoring systems
- Medical industry
- Logic gates for other digital devices
- Speed synchronization of multiple motors in industries
- Electronic circuits
- Data collection system
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLow Level Output CurrentHigh Level Output CurrentSupply TypeSupply VoltageSubcategoryMoisture Sensitivity Level (MSL)View Compare
MC14066BDR2G
ON Semiconductor14-SOIC (0.154, 3.90mm Width)
14
25 mA
25 mA
Dual
5 V
Multiplexer or Switches
1 (Unlimited)
MC14016BDR2GON Semiconductor14-SOIC (0.154, 3.90mm Width)
14
25 mA
25 mA
Single
5 V
Multiplexer or Switches
1 (Unlimited)
MC14066BDR2G
VS
MC14016BDR2G
CD4066BM96NA14-SOIC (0.154, 3.90mm Width)
14
-
-
Dual, Single
5 V
Multiplexer or Switches
1 (Unlimited)
MC14066BDR2G
VS
CD4066BM96
- CD4066BM96G4NA
14-SOIC (0.154, 3.90mm Width)
14
-
-
Dual, Single
5 V
Multiplexer or Switches
1 (Unlimited)
MC14066BDR2G
VS
CD4066BM96G4
- CD4066BMNA
14-SOIC (0.154, 3.90mm Width)
14
-
-
Dual, Single
5 V
Multiplexer or Switches
1 (Unlimited)
MC14066BDR2G
VS
CD4066BM
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1. Understand the shipping rules of the destination country
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If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the ON Semiconductor's MC14066BDR2G price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
