Microchip Technology MCP6491T-E/OT
MCP6491T-E/OT
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.920000
$0.920000
10
$0.873000
$8.730000
100
$0.823200
$82.320000
500
$0.776640
$388.320000
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Microchip Technology MCP6491T-E/OT information
Type
Parameter
Factory Lead Time
9 Weeks
Mounting Type
Surface Mount
Package / Case
SC-74A, SOT-753
Surface Mount
YES
Number of Pins
5
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
Published
2007
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
5
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn) - annealed
Subcategory
Operational Amplifier
Packing Method
TAPE AND REEL
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Reflow Temperature-Max (s)
40
Base Part Number
MCP6491
Qualification Status
Not Qualified
Output Type
Rail-to-Rail
Number of Channels
1
Number of Circuits
1
Nominal Supply Current
530μA
Slew Rate
6V/μs
Architecture
VOLTAGE-FEEDBACK
Amplifier Type
General Purpose
Common Mode Rejection Ratio
65 dB
Current - Input Bias
1pA
Voltage - Supply, Single/Dual (±)
2.4V~5.5V ±1.2V~2.75V
Input Offset Voltage (Vos)
-1.5mV
Bandwidth
7.5MHz
Unity Gain BW-Nom
7500 kHz
Voltage Gain
115dB
Power Supply Rejection Ratio (PSRR)
90dB
Low-Offset
NO
Frequency Compensation
YES
Voltage - Input Offset
1.5mV
Current - Output / Channel
15mA
Low-Bias
YES
Micropower
YES
Max Frequency
10kHz
Programmable Power
NO
Height
1.3mm
Length
3.1mm
Width
1.8mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
MCP6491T-E/OT Overview
In the package, you will find a SC-74A, SOT-753-case to contain the op amp ic. A General Purpose-type buffer amplifier is shown here. There is a Tape & Reel (TR) case that is delivered with the instrumentation amplifiers. There is a growing number of terminations approaching the number of 5. It is important to remember that this op amp should be operated at a voltage of 3V volts. A type of Operational Amplifier op amp ic can be identified by the fact that this is a type of Operational Amplifier device. An 5-pin op amp ic is included in the package. In terms of the input offset voltage, instrumentation amplifier rates at -1.5mV. The mounting type that is recommended for this electrical part is Surface Mount. In terms of operating temperatures, this buffer amplifier works very well at a temperature of around -40°C~125°C . Keeping the voltage gain at 115dB is the best course of action. A instrumentation amplifier like this has 1 circuits. As far as the device is concerned, buffer amplifier has 1 channels. This op amp ic outputs Rail-to-Rail signals, which is one of the many benefits it has. TAPE AND REEL is adopted to pack the instrumentation amplifier.
MCP6491T-E/OT Features
supply voltage of 3V
115dB voltage gain
Output Type: Rail-to-Rail
MCP6491T-E/OT Applications
There are a lot of Microchip Technology MCP6491T-E/OT Instrumentational OP Amps applications.
- Precision measurement
- Professional videography
- High gain DC amplifier
- ECG equipment
- Signal filtering
- Television
- Comparator
- Active probe
- Biopotential
- Broadcasting
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CircuitsSlew RateInput Offset Voltage (Vos)Power Supply Rejection Ratio (PSRR)Common Mode Rejection RatioSupply VoltageView Compare
MCP6491T-E/OT
Microchip TechnologySC-74A, SOT-753
5
1
6V/μs
-1.5 mV
90 dB
65 dB
3 V
- AD8601WDRTZ-REEL7Analog Devices Inc.
SC-74A, SOT-753
5
-
6V/μs
500 μV
75 dB
80 dB
3 V
MCP6491T-E/OT
VS
AD8601WDRTZ-REEL7
- OPA374AIDBVRNA
SC-74A, SOT-753
5
-
5V/μs
5 mV
92.04 dB
80 dB
5 V
MCP6491T-E/OT
VS
OPA374AIDBVR
- AD8601ART-REEL7Analog Devices Inc.
SC-74A, SOT-753
5
1
6V/μs
80 μV
67 dB
74 dB
3 V
MCP6491T-E/OT
VS
AD8601ART-REEL7
- OPA316IDBVRNA
SC-74A, SOT-753
5
1
6V/μs
500 μV
-
65 dB
5 V
MCP6491T-E/OT
VS
OPA316IDBVR
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
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1. We provide 365 days warranty for all electronic components.
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Microchip Technology's MCP6491T-E/OT price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.