STMicroelectronics STM32L051K8T6
STM32L051K8T6
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STMicroelectronics STM32L051K8T6 information
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 7 months ago)
Mounting Type
Surface Mount
Package / Case
32-LQFP
Surface Mount
YES
Number of Pins
32
Weight
773.99868mg
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Series
STM32L0
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
32
ECCN Code
3A991.A.2
Max Power Dissipation
526mW
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
3V
Terminal Pitch
0.8mm
Frequency
32MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
STM32L051
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
1.8V
Interface
I2C, I2S, IrDA, SPI, UART, USART
Memory Size
64kB
Oscillator Type
Internal
Number of I/O
27
RAM Size
8K x 8
Voltage - Supply (Vcc/Vdd)
1.65V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
ARM® Cortex®-M0+
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
64KB 64K x 8
Connectivity
I2C, IrDA, SPI, UART/USART
Supply Current-Max
6.8mA
Bit Size
32
Data Converter
A/D 10x12b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
YES
Data Bus Width
32b
PWM Channels
YES
Number of Timers/Counters
5
Core Architecture
ARM
EEPROM Size
2K x 8
On Chip Program ROM Width
8
CPU Family
CORTEX-M0
Boundary Scan
NO
Low Power Mode
YES
Number of Programmable I/O
25
Integrated Cache
NO
Number of ADC Channels
10
Height Seated (Max)
1.6mm
Length
7mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
STM32L051K8T6 Overview
In a 32-LQFP package, the MCU is available. A total of 27 I/Os are on the Microcontroller. There is a mounting type Surface Mount associated with this Microcontroller. This Microcontroller is based on a core called 32-Bit. The type of memory it uses for its program is FLASH. Temperatures within -40°C~85°C TA range are measured by this Microcontroller. STM32L0-series components are electrical components. Its program memory size is 64KB 64K x 8. ARM® Cortex®-M0+ Core processors are used in MCU. The device belongs to MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs Type. 32 is the number of terminations on the IC chip that are present. 32-bits are used for its size. The MCU chip's supply output is 3V volts. A total of YES DMA channels are available. 64kB memory size belongs to the Chip part. Alternatives can be found by searching through the base part number STM32L051 to find them. Using a 32MHz frequency, this electronic part can perform efficiently. Devices work in YES PWM channels. In this chip, 32 pins can be accessed. It comes with 5 timers/counters that can be set up. In addition to this, the device is embedded with the the CORTEX-M0 CPU family. As a result of its ARM core architecture, it can be used in many applications. As far as the programmability is concerned, it has 25 Programmable I/Os. A total of 10 channels of ADC are available on this device.
STM32L051K8T6 Features
32-LQFP package
Mounting type of Surface Mount
STM32L051K8T6 Applications
There are a lot of STMicroelectronics STM32L051K8T6 Microcontroller applications.
- 3D printers
- Blenders
- Plant factories
- Digital set-top boxes
- Digital cameras
- Hard drives
- Torpedo guidance
- Mice
- Air fryers
- Leakage current tester
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltageView Compare
STM32L051K8T6
STMicroelectronics32-LQFP
32
ARM
32 b
27
I2C, I2S, IrDA, SPI, UART, USART
64 kB
3 V
- STM32L052K8T6STMicroelectronics
32-LQFP
32
ARM
32 b
27
I2C, I2S, IrDA, SPI, UART, USART, USB
64 kB
3.3 V
STM32L051K8T6
VS
STM32L052K8T6
- STM32L062K8T6STMicroelectronics
32-LQFP
32
ARM
32 b
27
I2C, I2S, IrDA, SPI, UART, USART, USB
64 kB
3 V
STM32L051K8T6
VS
STM32L062K8T6
- STM32L052K8T7STMicroelectronics
32-LQFP
32
ARM
32 b
27
I2C, I2S, IrDA, SPI, UART, USART, USB
64 kB
3.3 V
STM32L051K8T6
VS
STM32L052K8T7
- S9KEAZN64AMLCNXP USA Inc.
32-LQFP
-
-
-
28
-
-
3 V
STM32L051K8T6
VS
S9KEAZN64AMLC
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.