Microchip Technology PIC24F16KA102-I/SS
PIC24F16KA102-I/SS
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Microchip Technology PIC24F16KA102-I/SS information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
28-SSOP (0.209, 5.30mm Width)
Number of Pins
28
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Published
1995
Series
PIC® XLP™ 24F
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
28
Termination
SMD/SMT
Terminal Finish
Matte Tin (Sn) - annealed
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Frequency
32MHz
Reflow Temperature-Max (s)
40
Base Part Number
PIC24F16KA102
Pin Count
28
Supply Voltage-Min (Vsup)
3V
Interface
I2C, IrDA, SPI, UART, USART
Memory Size
16kB
Oscillator Type
Internal
Number of I/O
24
RAM Size
1.5K x 8
Voltage - Supply (Vcc/Vdd)
1.8V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Number of Bits
16
Core Processor
PIC
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
16-Bit
Program Memory Size
16KB 5.5K x 24
Connectivity
I2C, IrDA, SPI, UART/USART
Bit Size
16
Data Converter
A/D 9x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
NO
Data Bus Width
16b
Number of Timers/Counters
3
Density
128 kb
EEPROM Size
512 x 8
CPU Family
PIC
Number of UART Channels
2
Number of ADC Channels
9
Number of PWM Channels
1
Height
1.85mm
Length
10.5mm
Width
5.6mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
PIC24F16KA102-I/SS Overview
The package has a 28-SSOP (0.209, 5.30mm Width) shape. There are 24 I/O ports on this device. Using the Mounting Type Surface Mount, the MCU is mounted on PCB. As the name implies, this Microcontroller is based on the 16-Bit core. This program has a type of memory called FLASH for this MCU's program memory. There is a temperature range of -40°C~85°C TA that is operated by this Microcontroller. A PIC® XLP™ 24F series electrical component is used in this application. This program has a program memory of 16KB 5.5K x 24 bytes, which is the size of the program. MCU is powered by PIC Core Processor. This device falls under the MICROCONTROLLER uPs/uCs/Peripheral ICs category. During the manufacturing process, 28 terminations were applied to the IC chip. 16-bits are the size of the data that comes with MCU. Microcontroller chip has outputs of 3.3V volts. With NO DMA channels, Microcontroller chip can handle large data transfers. 16kB memory size belongs to the part. Alternatives can be found by searching through the base part number PIC24F16KA102 to find them. MCU's frequency is 32MHz. On the chip, there are 28 pins that can be accessed. In total, it has 3 timers and counters in it. In total, it has 28 pins. The PIC CPU family is embedded in the device, so it can handle a wide range of operations. The device has 2 UART channels. It consists of 9 channels in total for the ADC. 16 bits are found on a chip. There are 1 PWM channels that are used by the device.
PIC24F16KA102-I/SS Features
28-SSOP (0.209, 5.30mm Width) package
Mounting type of Surface Mount
Microcontrollers subcategory
PIC24F16KA102-I/SS Applications
There are a lot of Microchip Technology PIC24F16KA102-I/SS Microcontroller applications.
- Process control devices
- Broadband technology
- Microwave ovens
- Leakage current tester
- Digital TVs
- DCS control intelligent sensor
- Kindle
- Walkie talkies
- PDAs, game consoles
- Toasters
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
PIC24F16KA102-I/SS
Microchip Technology28-SSOP (0.209, 5.30mm Width)
28
16 b
24
I2C, IrDA, SPI, UART, USART
16 kB
3.3 V
Brown-out Detect/Reset, POR, PWM, WDT
- PIC24FJ16GA002T-I/SSMicrochip Technology
28-SSOP (0.209, 5.30mm Width)
28
16 b
21
I2C, IrDA, SPI, UART, USART
16 kB
2.5 V
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24F16KA102-I/SS
VS
PIC24FJ16GA002T-I/SS
- PIC24F08KA102-I/SSMicrochip Technology
28-SSOP (0.209, 5.30mm Width)
28
16 b
24
I2C, IrDA, SPI, UART, USART
8 kB
3.3 V
Brown-out Detect/Reset, POR, PWM, WDT
PIC24F16KA102-I/SS
VS
PIC24F08KA102-I/SS
- PIC24FJ16GA002-I/SSMicrochip Technology
28-SSOP (0.209, 5.30mm Width)
28
16 b
21
I2C, IrDA, SPI, UART, USART
16 kB
-
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24F16KA102-I/SS
VS
PIC24FJ16GA002-I/SS
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Microchip Technology's PIC24F16KA102-I/SS price and stock displayed on the website accurate?
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.