Microchip Technology ATMEGA328P-AUR
ATMEGA328P-AUR
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Microchip Technology ATMEGA328P-AUR information
Type
Parameter
Factory Lead Time
6 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
32-TQFP
Number of Pins
32
Manufacturer Package Identifier
32-A
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
1997
Series
AVR® ATmega
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
32
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
5V
Frequency
20MHz
Reflow Temperature-Max (s)
40
Base Part Number
ATMEGA328P
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage-Min (Vsup)
4.5V
Interface
2-Wire, I2C, SPI, UART, USART
Memory Size
32kB
Oscillator Type
Internal
Number of I/O
23
RAM Size
2K x 8
Voltage - Supply (Vcc/Vdd)
1.8V~5.5V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
AVR
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
8-Bit
Program Memory Size
32KB 16K x 16
Connectivity
I2C, SPI, UART/USART
Supply Current-Max
5.5mA
Bit Size
8
Data Converter
A/D 8x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
NO
Data Bus Width
8b
PWM Channels
YES
Number of Timers/Counters
3
EEPROM Size
1K x 8
On Chip Program ROM Width
8
Boundary Scan
NO
Low Power Mode
YES
Format
FIXED POINT
Integrated Cache
NO
Number of ADC Channels
8
Number of External Interrupts
2
Number of I2C Channels
1
Number of SPI Channels
2
Height
1.2mm
Length
7mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Obsolescence/ EOL :
- PCN Design/Specification :
microchiptechnology-ata8204p3ctkqw-pcndesignspecification-9786.pdf
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
ATMEGA328P-AUR Overview
Packaged in a 32-TQFP format. There are 23 I/Os. The Microcontroller's mounting type is Surface Mount and this IC chip has the following features. This Microcontroller is based on a core called 8-Bit. The type of its program memory is FLASH. The Microcontroller runs in -40°C~85°C TA Operating Temperature. The AVR® ATmega series includes this electrical component. 32KB 16K x 16 is the size of its program memory. AVR Core processors are used in MCU. The IC chip fits into the MICROCONTROLLER, RISC uPs/uCs/Peripheral ICs category. There are 32 terminations on the IC chip, which means there are 32 terminations on the integrated circuit chip. Microcontroller comes with 8 bit size. Microcontroller chip has outputs of 5V volts. MCU chip has NO DMA channels. 32kB memory size belongs to the part. Using the base part number ATMEGA328P, you will be able to find alternatives for the part. It exhibits good efficiency when it operates at a frequency of 20MHz and it is able to operate at a high frequency. This MCU Chip uses YES PWM channels to operate. On the chip, there are 32 pins that are accessible. The clock has 3 timers or counters on it. A total of 8 ADC channels are present in this device. 1 I2C channels are integrated by the part. In addition to the internal interrupts, the part includes 2 external interrupts.
ATMEGA328P-AUR Features
32-TQFP package
Mounting type of Surface Mount
Microcontrollers subcategory
ATMEGA328P-AUR Applications
There are a lot of Microchip Technology ATMEGA328P-AUR Microcontroller applications.
Removable disks
Hand-held metering systems
Hard drives
Electrocardiogram (EKG)
CD players
Mobile computers
Mice
Accu-check
Dishwashers
Teletext terminals
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
ATMEGA328P-AUR
Microchip Technology32-TQFP
32
8 b
23
2-Wire, I2C, SPI, UART, USART
32 kB
5 V
Brown-out Detect/Reset, POR, PWM, WDT
- ATMEGA168A-AURMicrochip Technology
32-TQFP
32
8 b
23
I2C, LIN, SPI, UART, USART
14 kB
5 V
Brown-out Detect/Reset, POR, PWM, WDT
ATMEGA328P-AUR
VS
ATMEGA168A-AUR
- ATMEGA48PA-AURMicrochip Technology
32-TQFP
32
8 b
23
I2C, SPI, UART, USART
3.5 kB
5 V
Brown-out Detect/Reset, POR, PWM, WDT
ATMEGA328P-AUR
VS
ATMEGA48PA-AUR
- ATMEGA88A-AURMicrochip Technology
32-TQFP
32
8 b
23
I2C, SPI, UART, USART
1.5 kB
5 V
Brown-out Detect/Reset, POR, PWM, WDT
ATMEGA328P-AUR
VS
ATMEGA88A-AUR
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
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3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Microchip Technology's ATMEGA328P-AUR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
