Microchip Technology PIC24FJ64GB002-I/SO
PIC24FJ64GB002-I/SO
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Microchip Technology PIC24FJ64GB002-I/SO information
Type
Parameter
Factory Lead Time
17 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295, 7.50mm Width)
Number of Pins
28
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Published
1995
Series
PIC® XLP™ 24F
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
28
Termination
SMD/SMT
Terminal Finish
Matte Tin (Sn)
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
2.5V
Frequency
32MHz
Base Part Number
PIC24FJ64GB002
Pin Count
28
Interface
I2C, IrDA, LIN, SPI, UART, USART, USB
Memory Size
64kB
Oscillator Type
Internal
Number of I/O
19
RAM Size
8K x 8
Voltage - Supply (Vcc/Vdd)
2V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Number of Bits
16
Core Processor
PIC
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
16-Bit
Program Memory Size
64KB 22K x 24
Connectivity
I2C, IrDA, SPI, UART/USART, USB OTG
Bit Size
16
Data Converter
A/D 9x10b
Watchdog Timer
Yes
Has ADC
YES
DMA Channels
YES
Data Bus Width
16b
Density
512 kb
CPU Family
PIC
Number of A/D Converters
1
Number of ADC Channels
9
Number of PWM Channels
5
Number of I2C Channels
2
Height
2.3622mm
Length
15.3924mm
Width
7.493mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
PIC24FJ64GB002-I/SO Overview
This Microcontroller comes in a 28-SOIC (0.295, 7.50mm Width) package. With 19 I/Os, it's pretty good. It is important to note that the Microcontroller has a Surface Mount mounting type. There is a 16-Bit core at the core of this MCU. As far as its program memory type is concerned, it is FLASH. Temperatures in the range of -40°C~85°C TA are operated by this Microcontroller. The electrical component that you are looking at belongs to the PIC® XLP™ 24F series of components. Having a size of 64KB 22K x 24, Microcontroller has a program memory of X bytes. A PIC Core processor is used to power the device. This device belongs to the MICROCONTROLLER uPs/uCs/Peripheral ICs category. There are 28 terminations on the IC chip, which means there are 28 terminations on the integrated circuit chip. This part works in a 16-bit manner. Microcontroller chip has outputs of 2.5V volts. A total of YES DMA channels are available on MCU chip. 64kB is the memory size of the part. You can find alternatives through the base part number PIC24FJ64GB002. This device is extremely efficient when operated at a frequency of 32MHz. It is possible to access the 28 pins on the chip through the 28 pins. A total of 28 pins are present. In this device, there is a PIC CPU embedded within it. The device has a total of 9 ADC channels in total. A total of 1 A/D converters are included in this device. 16 bits are found on a chip. An 5-channel PWM controller is used by the device. 2 I2C channels are integrated by the part.
PIC24FJ64GB002-I/SO Features
28-SOIC (0.295, 7.50mm Width) package
Mounting type of Surface Mount
Microcontrollers subcategory
PIC24FJ64GB002-I/SO Applications
There are a lot of Microchip Technology PIC24FJ64GB002-I/SO Microcontroller applications.
- Virtual reality VR robots
- Measuring revolving objects
- Smart highways
- Mobile computers
- Xbox
- Digital set-top boxes
- Traditional industrial transformation
- Hard drives
- X-ray
- Hearing aids
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
PIC24FJ64GB002-I/SO
Microchip Technology28-SOIC (0.295, 7.50mm Width)
28
16 b
19
I2C, IrDA, LIN, SPI, UART, USART, USB
64 kB
2.5 V
Brown-out Detect/Reset, LVD, POR, PWM, WDT
- PIC24FJ16GA002-I/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
16 b
21
I2C, IrDA, SPI, UART, USART
16 kB
-
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24FJ64GB002-I/SO
VS
PIC24FJ16GA002-I/SO
- PIC24FJ32GA002-I/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
16 b
21
I2C, IrDA, SPI, UART, USART
32 kB
-
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24FJ64GB002-I/SO
VS
PIC24FJ32GA002-I/SO
- PIC24FJ32GB002-I/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
16 b
19
I2C, IrDA, SPI, UART, USART, USB
32 kB
-
Brown-out Detect/Reset, LVD, POR, PWM, WDT
PIC24FJ64GB002-I/SO
VS
PIC24FJ32GB002-I/SO
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Microchip Technology's PIC24FJ64GB002-I/SO price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
