STMicroelectronics STM32F446MEY6TR
STM32F446MEY6TR
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STMicroelectronics STM32F446MEY6TR information
Type
Parameter
Factory Lead Time
12 Weeks
Lifecycle Status
ACTIVE (Last Updated: 7 months ago)
Mounting Type
Surface Mount
Package / Case
81-UFBGA, WLCSP
Surface Mount
YES
Number of Pins
81
Operating Temperature
-40°C~85°C TA
Packaging
Cut Tape (CT)
Series
STM32F4
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
81
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Supply Voltage
3.3V
Terminal Pitch
0.4mm
Frequency
180MHz
Base Part Number
STM32F446
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.6V
Supply Voltage-Min (Vsup)
1.7V
Interface
CAN, EBI/EMI, I2C, IrDA, LIN, SD, SPI, UART, USART, USB
Memory Size
512kB
Oscillator Type
Internal
Number of I/O
63
RAM Size
128K x 8
Voltage - Supply (Vcc/Vdd)
1.7V~3.6V
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
ARM® Cortex®-M4
Peripherals
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Program Memory Type
FLASH
Core Size
32-Bit
Program Memory Size
512KB 512K x 8
Connectivity
CANbus, EBI/EMI, I2C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB, USB OTG
Supply Current-Max
115mA
Bit Size
32
Data Converter
A/D 14x12b; D/A 2x12b
Has ADC
YES
DMA Channels
YES
PWM Channels
YES
DAC Channels
YES
Address Bus Width
6
ROM (words)
524288
Core Architecture
ARM
On Chip Program ROM Width
8
CPU Family
CORTEX-M4
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
6
Format
FLOATING-POINT
Integrated Cache
NO
Number of External Interrupts
16
Number of DMA Channels
2
Height Seated (Max)
0.6mm
Width
3.693mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
- Datasheets :
STM32F446MEY6TR Overview
The package has a 81-UFBGA, WLCSP shape. There are 63 I/O ports on this device. Surface Mount is the mounting type of the Microcontroller that is attached to the panel. The MCU is based on the 32-Bit core. This Microcontroller's program memory type is FLASH. In this Microcontroller, temperature is controlled within the range -40°C~85°C TA. The STM32F4 series is comprised of this electrical component. Its program memory size is 512KB 512K x 8. With a ARM® Cortex®-M4 Core Processor, Microcontroller is fast and efficient. This Microcontroller belongs to the MICROCONTROLLER, RISC uPs/uCs/peripheral ICs type. There are 81 terminations on the IC chip. Microcontroller comes with 32 bit size. The MCU chip's supply output is 3.3V volts. The system has YES channels for DMA communication. The part has a memory size of 512kB. Alternatives can be found by looking at the base part number STM32F446. A good performance can be achieved at a frequency of 180MHz, as long as it is operated at a low power consumption. It is possible for the device to work with the motor using the PWM channel YES. The chip has 81 pins. There is an embedded the CORTEX-M4 CPU family inside the device, which makes it a powerful device. It has a ARM core architecture integrated into it. There are 16 external interrupts included in this chip part.
STM32F446MEY6TR Features
81-UFBGA, WLCSP package
Mounting type of Surface Mount
STM32F446MEY6TR Applications
There are a lot of STMicroelectronics STM32F446MEY6TR Microcontroller applications.
- Digital TVs
- Firewalls
- DCS control intelligent sensor
- Projector
- Broadband technology
- Leakage current tester
- Accu-check
- Binding machines
- Security systems
- 3D printers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsCore ArchitectureNumber of I/OInterfaceMemory SizeSupply VoltagePeripheralsView Compare
STM32F446MEY6TR
STMicroelectronics81-UFBGA, WLCSP
81
ARM
63
CAN, EBI/EMI, I2C, IrDA, LIN, SD, SPI, UART, USART, USB
512 kB
3.3 V
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
ATSAM3X8CA-CUMicrochip Technology100-TFBGA
100
ARM
63
CAN, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB
512 kB
1.8 V
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
STM32F446MEY6TR
VS
ATSAM3X8CA-CU
STM32F411RET6STMicroelectronics64-LQFP
64
ARM
50
I2C, I2S, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB
512 kB
3.3 V
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
STM32F446MEY6TR
VS
STM32F411RET6
ATSAM3A8CA-AUMicrochip Technology100-LQFP
100
ARM
63
CAN, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB
512 kB
1.8 V
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
STM32F446MEY6TR
VS
ATSAM3A8CA-AU
- ATSAM3A8CA-CUMicrochip Technology
100-TFBGA
100
ARM
63
CAN, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB
512 kB
1.8 V
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
STM32F446MEY6TR
VS
ATSAM3A8CA-CU
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
