Texas Instruments SN74V293PZAEP
SN74V293PZAEP
In Stock:94131
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Unit Price
Ext Price
1
$26.670000
$26.670000
10
$25.158000
$251.580000
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Texas Instruments SN74V293PZAEP information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
80-LQFP
Number of Pins
80
Weight
639.990485mg
Operating Temperature
-55°C~125°C
Packaging
Tray
Series
74V
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
80
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
FIFOs
Technology
CMOS
Voltage - Supply
3.15V~3.45V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Frequency
133MHz
Base Part Number
74V293
Function
Synchronous
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.45V
Supply Voltage-Min (Vsup)
3.15V
Number of Circuits
2
Memory Size
1.125M 64K x 18 128K x 9
Element Configuration
Dual
Nominal Supply Current
35mA
Max Supply Current
35mA
Access Time
5ns
Data Bus Width
18b
Direction
Unidirectional
Organization
64KX18
Output Characteristics
3-STATE
Density
1.1 Mb
Standby Current-Max
0.015A
Parallel/Serial
PARALLEL
Memory IC Type
OTHER FIFO
Bus Directional
Uni-Directional
FWFT Support
Yes
Output Enable
YES
Expansion Type
Depth, Width
Cycle Time
7.5 ns
Height
1.6mm
Length
14mm
Width
14mm
Thickness
1.4mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Packaging :
- Datasheets :
SN74V293PZAEP Overview
You will find FIFO memory chip in the 80-LQFP package.This FIFO memory chip is packaged as a Tray .Apps and data can be stored in the 1.125M 64K x 18 128K x 9 memory of the FIFO chip.To ensure reliable operation, the temperature should be regulated to -55°C~125°C .It is a Surface Mount mounting type FIFO memory.A supply voltage of 3.15V~3.45V is required for its operation.It is a component from the 74V series.The recommended mounting way is Surface Mount .Memory IC belongs to the family of 74V293 .When the supply voltage is 3.3V , high efficiency is possible.A total of 80 terminations can be found in FIFO means.As far as the operation pins are concerned, they are 80 pins.In order for FIFO design to operate, a maximum current of 35mA is required.In order to maximize efficiency, the supply voltage should be set to 3.3V .The gadget in FIFOs is self-contained.ICs of type OTHER FIFO are used in the FIFO memory chip.In spite of the frequency 133MHz , it is capable of maintaining a good level of accuracy.There is a FIFO memory IC's maximum supply voltage of 3.45V .Ideally, the supply voltage (Vsup) should stay above 3.15V .FIFO memory chip offers enhanced flexibility due to its use of 2 circuits.
SN74V293PZAEP Features
1.125M 64K x 18 128K x 9 memory size
74V series
Best part number of 74V293
FIFOs category
SN74V293PZAEP Applications
There are a lot of Texas Instruments SN74V293PZAEP FIFOs Memory applications.
- Smart Meter
- Firmware loaders
- Telecommunication
- Communications Systems
- Extended product-change notification
- Test Equipment
- High-speed disk
- Extended product life cycle
- Alarm System
- Optical memories
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory SizeAccess TimeFrequencyBus DirectionalFWFT SupportSupply VoltageView Compare
SN74V293PZAEP
NA80-LQFP
80
1.125M (64K x 18)(128K x 9)
5ns
133 MHz
Uni-Directional
Yes
3.3 V
- SN74V283PZAEPNA
80-LQFP
80
576K (32K x 18)(64K x 9)
5ns
133 MHz
Uni-Directional
Yes
3.3 V
SN74V293PZAEP
VS
SN74V283PZAEP
- SN74V273PZAEPNA
80-LQFP
80
288K (16K x 18)(32K x 9)
5ns
133 MHz
Uni-Directional
Yes
3.3 V
SN74V293PZAEP
VS
SN74V273PZAEP
- SN74V263PZAEPNA
80-LQFP
80
144K (8K x 18)(16K x 9)
5ns
133 MHz
Uni-Directional
Yes
3.3 V
SN74V293PZAEP
VS
SN74V263PZAEP
72V225L10TFGIntegrated Device Technology (IDT)LQFP
64
2.3 kB
6.5 ns
-
Unidirectional
Yes
3.3 V
SN74V293PZAEP
VS
72V225L10TFG
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s SN74V293PZAEP price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
