Cypress Semiconductor Corp CYF0072V18L-133BGXI
CYF0072V18L-133BGXI
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Cypress Semiconductor Corp CYF0072V18L-133BGXI information
Type
Parameter
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
209-BGA
Number of Pins
209
Operating Temperature
-40°C~85°C
Packaging
Tray
Published
2009
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
209
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.32.00.71
Subcategory
FIFOs
Technology
CMOS
Voltage - Supply
1.7V~1.9V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.5V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
CYF0072V18
Function
Synchronous
Operating Supply Voltage
1.8V
Supply Voltage-Max (Vsup)
1.575V
Supply Voltage-Min (Vsup)
1.425V
Memory Size
72M 2M x 36
Element Configuration
Dual
Supply Current-Max
0.6mA
Access Time
10ns
Data Bus Width
36b
Organization
2MX36
Memory Width
36
Density
72 Mb
Max Frequency
133MHz
Parallel/Serial
PARALLEL
Memory IC Type
OTHER FIFO
Bus Directional
Uni-Directional
FWFT Support
No
Programmable Flags Support
Yes
Output Enable
YES
Expansion Type
Width
Cycle Time
7.5 ns
Height Seated (Max)
1.96mm
Length
22mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
cypresssemiconductorcorp-cy467269103pod-environmentalinformation-2998.pdf
- RohsStatement :
- PCN Packaging :
cypresssemiconductorcorp-cy467269103pod-pcnpackaging-3002.pdf
- PCN Assembly/Origin :
- PCN Obsolescence/ EOL :
CYF0072V18L-133BGXI Overview
You will find FIFO memory chip in the 209-BGA package.It's packaged in the shape of a Tray .There is a 72M 2M x 36 MB memory on the FIFO chips, which can be used to store both applications and data.Keeping the temperature at -40°C~85°C will ensure reliable operation.There is Surface Mount mounting type for this FIFO memory.A voltage supply of 1.7V~1.9V is needed to operate it.A Surface Mount mounting method is recommended.The CYF0072V18 family contains this item.When the supply voltage is 1.5V , high efficiency is possible.A total of 209 terminations can be found in FIFO means.FIFO design has 209 operation pins.For FIFO's maximum efficiency, the supply voltage should be set to 1.8V .The gadget in FIFOs is self-contained.There is a memory type OTHER FIFO in the IC of this part.The FIFO memory IC's maximum supply voltage is set to 1.575V .The supply voltage (Vsup) should remain above 1.425V to ensure normal operation.
CYF0072V18L-133BGXI Features
72M 2M x 36 memory size
Best part number of CYF0072V18
FIFOs category
CYF0072V18L-133BGXI Applications
There are a lot of Cypress Semiconductor Corp CYF0072V18L-133BGXI FIFOs Memory applications.
- Computers
- Microprogramming
- General Data Collection Applications at Extreme High-Temperatures
- TVs
- Telecommunication
- Notebook
- Cardiac Monitoring Device
- Seismic Data Collection at Extreme Temperatures
- Data communications
- MP3 Interface for Automobile
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory IC TypeDensityAccess TimeSupply VoltageTerminal PositionTerminal PitchView Compare
CYF0072V18L-133BGXI
Cypress Semiconductor Corp209-BGA
209
OTHER FIFO
72 Mb
10ns
1.5 V
BOTTOM
1 mm
- CYF0036V33L-133BGXICypress Semiconductor Corp
209-BGA
209
OTHER FIFO
36 Mb
10ns
1.5 V
BOTTOM
1 mm
CYF0072V18L-133BGXI
VS
CYF0036V33L-133BGXI
- CYF0018V33L-133BGXICypress Semiconductor Corp
209-BGA
209
OTHER FIFO
18 Mb
10ns
1.5 V
BOTTOM
1 mm
CYF0072V18L-133BGXI
VS
CYF0018V33L-133BGXI
IS61LF102418A-7.5B3ISSI, Integrated Silicon Solution Inc165-TBGA
165
-
18 Mb
7.5ns
3.3 V
BOTTOM
1 mm
CYF0072V18L-133BGXI
VS
IS61LF102418A-7.5B3
- IS64LF25636A-7.5B3LA3ISSI, Integrated Silicon Solution Inc
165-TBGA
165
-
9 Mb
7.5ns
-
BOTTOM
1 mm
CYF0072V18L-133BGXI
VS
IS64LF25636A-7.5B3LA3
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Cypress Semiconductor's CYF0072V18L-133BGXI price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
