Texas Instruments SN74V293-15PZAG4
SN74V293-15PZAG4
In Stock:94131
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Texas Instruments SN74V293-15PZAG4 information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
80-LQFP
Number of Pins
80
Operating Temperature
0°C~70°C
Packaging
Tube
Series
74V
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
80
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
FIFOs
Technology
CMOS
Voltage - Supply
3.15V~3.45V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Frequency
66.7MHz
Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
74V293
Function
Synchronous
Current - Supply (Max)
35mA
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.45V
Supply Voltage-Min (Vsup)
3.15V
Number of Circuits
2
Memory Size
1.125M 64K x 18 128K x 9
Element Configuration
Dual
Max Supply Current
35mA
Access Time
10ns
Data Bus Width
18b
Direction
Unidirectional
Organization
64KX18
Output Characteristics
3-STATE
Density
1.1 Mb
Standby Current-Max
0.015A
Parallel/Serial
PARALLEL
Memory IC Type
OTHER FIFO
Bus Directional
Uni-Directional
FWFT Support
Yes
Output Enable
YES
Expansion Type
Depth, Width
Cycle Time
15 ns
Height
1.6mm
Length
14mm
Width
14mm
Thickness
1.4mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Packaging :
SN74V293-15PZAG4 Overview
80-LQFP is the package in which FIFO memory chip is contained.There is a case Tube in which it is packaged.There is a memory of 1.125M 64K x 18 128K x 9 on the FIFO chip that can be used to store applications and data.It is recommended that the temperature be regulated to 0°C~70°C to ensure reliable operation.There is a mounting type of Surface Mount on the FIFO memory.Operating voltage is 3.15V~3.45V .It is a component from the 74V series.As far as operating current is concerned, it has a maximum of 35mA .Mounting it in Surface Mount is recommended.Memory IC is a member of the 74V293 family.If the supply voltage is set to 3.3V , high efficiency can be achieved.A total of 80 terminations can be found in FIFO means.The operation pins are 80 pins.FIFO design requires 35mA amps of current to operate.A 3.3V supply voltage will ensure FIFO's maximum efficiency.The gadget is self-contained and can be found in FIFOs .It has a type OTHER FIFO memory IC.In the presence of a 66.7MHz frequency, it can maintain good accuracy.Voltage FIFO memory IC's maximum is set to 3.45V .Ideally, the supply voltage (Vsup) should stay above 3.15V .With 2 circuits, FIFO memory chip offers enhanced flexibility.
SN74V293-15PZAG4 Features
1.125M 64K x 18 128K x 9 memory size
74V series
Best part number of 74V293
FIFOs category
SN74V293-15PZAG4 Applications
There are a lot of Texas Instruments SN74V293-15PZAG4 FIFOs Memory applications.
- Extended product life cycle
- Video time base correction
- Controlled baseline
- IP Radio
- Multi-stage synchronizer
- Notebook
- Magnetic memories
- Product traceability
- Programmable Logic Controller
- Rate buffers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory SizeAccess TimeFrequencyBus DirectionalFWFT SupportSupply VoltageView Compare
SN74V293-15PZAG4
NA80-LQFP
80
1.125M (64K x 18)(128K x 9)
10ns
66.7 MHz
Uni-Directional
Yes
3.3 V
- SN74V263-15PZANA
80-LQFP
80
144K (8K x 18)(16K x 9)
10ns
66.7 MHz
Uni-Directional
Yes
3.3 V
SN74V293-15PZAG4
VS
SN74V263-15PZA
- SN74V273-15PZANA
80-LQFP
80
288K (16K x 18)(32K x 9)
10ns
66.7 MHz
Uni-Directional
Yes
3.3 V
SN74V293-15PZAG4
VS
SN74V273-15PZA
- SN74V283-15PZANA
80-LQFP
80
576K (32K x 18)(64K x 9)
10ns
66.7 MHz
Uni-Directional
Yes
3.3 V
SN74V293-15PZAG4
VS
SN74V283-15PZA
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72V255LA15TFGIIntegrated Device Technology (IDT)LQFP
64
-
10 ns
66.7 MHz
Unidirectional
-
-
SN74V293-15PZAG4
VS
72V255LA15TFGI
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s SN74V293-15PZAG4 price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
