Texas Instruments SN74V263PZAEP
SN74V263PZAEP
In Stock:94131
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Texas Instruments SN74V263PZAEP information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
80-LQFP
Number of Pins
80
Operating Temperature
-55°C~125°C
Packaging
Tray
Series
74V
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
80
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Additional Feature
CAN ALSO BE CONFIGURED AS 16384 X 9
Subcategory
FIFOs
Technology
CMOS
Voltage - Supply
3.15V~3.45V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Frequency
133MHz
Base Part Number
74V263
Function
Synchronous
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.45V
Supply Voltage-Min (Vsup)
3.15V
Number of Circuits
2
Memory Size
144K 8K x 18 16K x 9
Element Configuration
Dual
Nominal Supply Current
35mA
Max Supply Current
35mA
Access Time
5ns
Data Bus Width
18b
Direction
Unidirectional
Organization
8KX18
Output Characteristics
3-STATE
Density
144 kb
Standby Current-Max
0.015A
Parallel/Serial
PARALLEL
Memory IC Type
OTHER FIFO
Bus Directional
Uni-Directional
FWFT Support
Yes
Output Enable
YES
Expansion Type
Depth, Width
Cycle Time
7.5 ns
Height
1.6mm
Length
14mm
Width
14mm
Thickness
1.4mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Packaging :
SN74V263PZAEP Overview
FIFO memory chip is contained in the 80-LQFP package.In this case, it is packaged in case number Tray .There is a memory of 144K 8K x 18 16K x 9 available for storing data and applications.A temperature regulation of -55°C~125°C is crucial for reliable operation.Surface Mount is the mounting type of the FIFO memory.A voltage supply of 3.15V~3.45V is needed to operate it.The memory logic belongs to the series 74V .Mounting it in Surface Mount is recommended.In addition, it is among the members of the 74V263 family.A supply voltage of 3.3V is capable of producing high efficiency.FIFO means contains 80 terminations.FIFO design has 80 operation pins.Its maximum operating current is 35mA .When the supply voltage is set to 3.3V , the FIFO's maximum efficiency is achieved.There is a self-contained gadget within FIFOs .This part is equipped with an IC of type OTHER FIFO memory.Despite a frequency of 133MHz , it is capable of maintaining good accuracy.Additionally, this FIFO memory is capable of generating CAN ALSO BE CONFIGURED AS 16384 X 9 as well.As a result, Vsup is set at 3.45V (FIFO memory IC's maximum voltage supply).To ensure normal operation, the supply voltage should be greater than 3.15V (Vsup).By using 2 circuits, FIFO memory chip has greater flexibility.
SN74V263PZAEP Features
144K 8K x 18 16K x 9 memory size
74V series
Best part number of 74V263
FIFOs category
SN74V263PZAEP Applications
There are a lot of Texas Instruments SN74V263PZAEP FIFOs Memory applications.
- Event Recorder
- GPS Offender Tracking
- Game Controller
- Look-up Tables
- Multi-stage synchronizer
- General Data Collection Applications at Extreme High-Temperatures
- Computer networks
- Multimedia
- Portable Information Devices
- Computers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsMemory SizeAccess TimeFrequencyBus DirectionalFWFT SupportSupply VoltageView Compare
SN74V263PZAEP
NA80-LQFP
80
144K (8K x 18)(16K x 9)
5ns
133 MHz
Uni-Directional
Yes
3.3 V
- SN74V263-7PZANA
80-LQFP
80
144K (8K x 18)(16K x 9)
5ns
133 MHz
Uni-Directional
Yes
3.3 V
SN74V263PZAEP
VS
SN74V263-7PZA
- SN74V263-10PZANA
80-LQFP
80
144K (8K x 18)(16K x 9)
6.5ns
100 MHz
Uni-Directional
Yes
3.3 V
SN74V263PZAEP
VS
SN74V263-10PZA
- SN74V273-7PZANA
80-LQFP
80
288K (16K x 18)(32K x 9)
5ns
133 MHz
Uni-Directional
Yes
3.3 V
SN74V263PZAEP
VS
SN74V273-7PZA
72V245L10TFGIntegrated Device Technology (IDT)LQFP
64
9 kB
6.5 ns
100 MHz
Unidirectional
Yes
3.3 V
SN74V263PZAEP
VS
72V245L10TFG
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
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2.Are the Texas Instruments Incorporated (TI)'s SN74V263PZAEP price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
