Microchip Technology TC4425AVPA
TC4425AVPA
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.640000
$0.640000
10
$0.606000
$6.060000
100
$0.572100
$57.210000
500
$0.539700
$269.850000
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Microchip Technology TC4425AVPA information
Type
Parameter
Factory Lead Time
7 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Number of Pins
8
Operating Temperature
-40°C~150°C TJ
Packaging
Tube
Published
2003
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
MOSFET Drivers
Max Power Dissipation
730mW
Technology
CMOS
Voltage - Supply
4.5V~18V
Terminal Position
DUAL
Number of Functions
2
Supply Voltage
5V
Base Part Number
TC4425A
Pin Count
8
Number of Outputs
2
Max Output Current
4.5A
Nominal Supply Current
250μA
Power Dissipation
1.2W
Max Supply Current
2mA
Propagation Delay
48 ns
Input Type
Inverting, Non-Inverting
Turn On Delay Time
48 ns
Rise Time
35ns
Fall Time (Typ)
35 ns
Rise / Fall Time (Typ)
12ns 12ns
Interface IC Type
BUFFER OR INVERTER BASED MOSFET DRIVER
Channel Type
Independent
Output Peak Current Limit-Nom
3A
Driven Configuration
Low-Side
Gate Type
N-Channel, P-Channel MOSFET
Current - Peak Output (Source, Sink)
4.5A 4.5A
High Side Driver
YES
Logic Voltage - VIL, VIH
0.8V 2.4V
Height
4.95mm
Length
10.16mm
Width
7.11mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
TC4425AVPA Overview
The 8-DIP (0.300, 7.62mm) package provides greater flexibility.A package of Tube has been used.Through Hole is mounted in the way.A supply voltage of 4.5V~18V demonstrates its superiority.A gate type of N-Channel, P-Channel MOSFET is used in its design.Temperature range -40°C~150°C TJ is allowed for this device.This program uses the input type of Inverting, Non-Inverting.Its configuration is based on a total of 8 terminations.The base part number TC4425A refers to a number of related parts.Devices are mounted by Through Hole.Mosfet driver is configured wMosfet driverh 8 pins when designing.Mosfet driver is designed specifically to run on 5V volts of power.The interface IC of the device is BUFFER OR INVERTER BASED MOSFET DRIVER.There is an output current limit of 4.5A for this device.This subcategory of MOSFET Drivers has a number of useful electronic components.The board contains 8 pins for component connections.The basis of the model has 2 outputs integrated.Having the maximum power dissipation of 730mW indicates its maximum capacity to conduct power losses without overheating.In order to ensure greater stability, it is recommended to keep the supply current at 2mA.
TC4425AVPA Features
Embedded in the Tube package
Employing a gate type of N-Channel, P-Channel MOSFET
8 pins
Maximum power dissipation of 730mW
TC4425AVPA Applications
There are a lot of Microchip Technology TC4425AVPA gate drivers applications.
- Isolated Gate Driver Supplies
- LCD/LCoS/DLP portable and embedded pico projectors
- Motor controllers
- Commercial and agricultural vehicles (CAV)
- Solar power supplies
- Active filtering
- Isolated switch mode power supplies (SMPS)
- Refrigerator
- Industrial Power Supplies
- AC-DC Inverters
- ImagePart NumberManufacturerPackage / CaseNumber of PinsChannel TypeMax Output CurrentRise TimeSupply VoltageMax Power DissipationPower DissipationView Compare
TC4425AVPA
Microchip Technology8-DIP (0.300, 7.62mm)
8
Independent
4.5 A
35 ns
5 V
730 mW
1.2 W
- TC4426ACPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
1.5 A
35 ns
-
730 mW
730 mW
TC4425AVPA
VS
TC4426ACPA
- TC4427ACPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
1.5 A
35 ns
-
730 mW
730 mW
TC4425AVPA
VS
TC4427ACPA
- TC4427AEPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
1.5 A
35 ns
-
730 mW
730 mW
TC4425AVPA
VS
TC4427AEPA
- MIC4424CNMicrochip Technology
8-DIP (0.300, 7.62mm)
-
Independent
-
-
-
-
-
TC4425AVPA
VS
MIC4424CN
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2.Are the Microchip Technology's TC4425AVPA price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.