Microchip Technology TC4423CPA
TC4423CPA
In Stock:94131
Qty
Unit Price
Ext Price
1
$1.560000
$1.560000
10
$1.474000
$14.740000
100
$1.390200
$139.020000
500
$1.311500
$655.750000
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Microchip Technology TC4423CPA information
Type
Parameter
Factory Lead Time
7 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Number of Pins
8
Operating Temperature
0°C~150°C TJ
Packaging
Tube
Published
2003
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
MOSFET Drivers
Max Power Dissipation
730mW
Technology
CMOS
Voltage - Supply
4.5V~18V
Terminal Position
DUAL
Number of Functions
2
Base Part Number
TC4423
Pin Count
8
Number of Outputs
2
Output Voltage
18V
Max Output Current
3A
Nominal Supply Current
2.5mA
Power Dissipation
730mW
Output Current
3A
Max Supply Current
2.5mA
Propagation Delay
75 ns
Input Type
Inverting
Turn On Delay Time
75 ns
Rise Time
35ns
Fall Time (Typ)
35 ns
Rise / Fall Time (Typ)
23ns 25ns
Interface IC Type
BUFFER OR INVERTER BASED MOSFET DRIVER
Channel Type
Independent
Input Bias Current
10μA
Turn On Time
0.1 μs
Output Peak Current Limit-Nom
3A
Driven Configuration
Low-Side
Gate Type
N-Channel, P-Channel MOSFET
Current - Peak Output (Source, Sink)
3A 3A
High Side Driver
YES
Logic Voltage - VIL, VIH
0.8V 2.4V
Turn Off Time
0.1 μs
Height
3.683mm
Length
9.779mm
Width
6.604mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
TC4423CPA Overview
Gate drivers provides greater flexibilGate driversy to use the 8-DIP (0.300, 7.62mm) package.A packaging method of Tube is indicated.In the direction of Through Hole, gate drivers is mounted.In the absence of a power supply voltage of 4.5V~18V V, it is able to demonstrate its superiority.A gate type of N-Channel, P-Channel MOSFET is used in its design.This device allows temperatures in the range of 0°C~150°C TJ.Mosfet driver uses Inverting as Mosfet drivers input type.Initially, the configuration is composed of 8 terminations.Mosfet driver contains a variety of related parts under Mosfet drivers base part number TC4423.The mount method is Through Hole.A total of 8 pins are available on the device.There is an interface IC called BUFFER OR INVERTER BASED MOSFET DRIVER that is employed in this device.As a maximum, there is 3A limit to the output current.The subcategory of MOSFET Drivers contains a wide variety of useful electronic components.There are 8 component pins on the board.Mosfet driver is based on a basis of 2 outputs that have been integrated.The output current can be set to 3A.Considering its maximum power dissipation, 730mW shows its maximum capacity to transfer and conduct power loss without overheating.If you want a stable supply current, you should keep it at 2.5mA.Mosfet gate drivers produces a voltage of 18V.
TC4423CPA Features
Embedded in the Tube package
Employing a gate type of N-Channel, P-Channel MOSFET
8 pins
Maximum power dissipation of 730mW
TC4423CPA Applications
There are a lot of Microchip Technology TC4423CPA gate drivers applications.
- Uninterruptible Power Supplies (UPS)
- General Purpose 3-Phase Inverter
- 3-Phase Motor Inverter Driver
- DC/DC converters
- Driving GaN Power Transistors used in Full or Half?Bridge, LLC,
- Video amplifiers
- High frequency line drivers
- High-speed communications
- Industrial Power Supplies
- Isolated switch mode power supplies (SMPS)
- ImagePart NumberManufacturerPackage / CaseNumber of PinsChannel TypeMax Output CurrentOutput CurrentRise TimeMax Power DissipationPower DissipationView Compare
TC4423CPA
Microchip Technology8-DIP (0.300, 7.62mm)
8
Independent
3 A
3 A
35 ns
730 mW
730 mW
- TC4424EPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
3 A
3 A
35 ns
730 mW
730 mW
TC4423CPA
VS
TC4424EPA
- TC4425CPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
3 A
-
35 ns
730 mW
730 mW
TC4423CPA
VS
TC4425CPA
- TC4424CPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
Independent
3 A
3 A
35 ns
730 mW
730 mW
TC4423CPA
VS
TC4424CPA
- MIC4424CNMicrochip Technology
8-DIP (0.300, 7.62mm)
-
Independent
-
-
-
-
-
TC4423CPA
VS
MIC4424CN
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2.Are the Microchip Technology's TC4423CPA price and stock displayed on the website accurate?
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
