Microchip Technology TC4424AVPA
TC4424AVPA
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Microchip Technology TC4424AVPA information
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Number of Pins
8
Supplier Device Package
8-PDIP
Operating Temperature
-40°C~150°C TJ
Packaging
Tube
Published
2003
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Max Operating Temperature
125°C
Min Operating Temperature
-40°C
Max Power Dissipation
730mW
Voltage - Supply
4.5V~18V
Base Part Number
TC4424A
Number of Outputs
2
Output Voltage
17.975V
Max Output Current
4.5A
Number of Channels
2
Max Supply Voltage
18V
Min Supply Voltage
4.5V
Nominal Supply Current
250μA
Power Dissipation
1.2W
Output Current
3A
Max Supply Current
2mA
Propagation Delay
48 ns
Input Type
Non-Inverting
Turn On Delay Time
48 ns
Rise Time
21ns
Fall Time (Typ)
21 ns
Rise / Fall Time (Typ)
12ns 12ns
Channel Type
Independent
Number of Drivers
2
Input Bias Current
10μA
Driven Configuration
Low-Side
Gate Type
N-Channel, P-Channel MOSFET
Current - Peak Output (Source, Sink)
4.5A 4.5A
Logic Voltage - VIL, VIH
0.8V 2.4V
Height
4.06mm
Length
10.16mm
Width
6.6mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
TC4424AVPA Overview
A higher degree of flexibility is achieved by adopting its 8-DIP (0.300, 7.62mm) package.Tube is the packaging method.This configuration includes 2 drivers.Through Hole is the way in which it is mounted.In the absence of a 4.5V~18V supply voltage, it can demonstrate its superiority.A gate type of N-Channel, P-Channel MOSFET is used in its design.This device can operate at temperatures up to -40°C~150°C TJ.The input type is Non-Inverting.Numerous related parts can be found under its base part number TC4424A.Mounting the device requires Through Hole.As a result, it is configured with 8 pins when it is designed.As a maximum, there is 4.5A limit to the output current.Mosfet driver has been integrated wMosfet driverh a total of 2 outputs for Mosfet drivers basis.The output current supported by the device is 3A.Mosfet gate drivers is permissible to operate at a temperature of 125°C.The allowable minimum value of operating temperature is -40°C.Having the maximum power dissipation of 730mW indicates its maximum capacity to conduct power losses without overheating.To maintain higher stability, the supply current should always be 2mA.The maximum voltage for operation is 18V.Its minimum operating voltage is 4.5V.17.975V is the output voltage.Mosfet gate drivers is configured wMosfet gate driversh 2 channels for operation.
TC4424AVPA Features
Embedded in the Tube package
2 drivers
Employing a gate type of N-Channel, P-Channel MOSFET
8 pins
Maximum power dissipation of 730mW
TC4424AVPA Applications
There are a lot of Microchip Technology TC4424AVPA gate drivers applications.
- Motor Control
- Telecom switch mode power supplies
- 48 V to 12 V PoL Converters, 48 V to Low Voltage Bus Converter,
- Isolated switch mode power supplies (SMPS)
- Line drivers
- White Goods - Air Conditioner, Washing Machine,
- Refrigerator
- Active filtering
- Power factor correction (PFC) circuits
- High frequency line drivers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of DriversMax Output CurrentOutput CurrentRise TimeMin Supply VoltageMax Supply VoltageMax Power DissipationView Compare
TC4424AVPA
Microchip Technology8-DIP (0.300, 7.62mm)
8
2
4.5 A
3 A
21 ns
4.5 V
18 V
730 mW
- TC4428EPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
2
1.5 A
-
19 ns
-
-
730 mW
TC4424AVPA
VS
TC4428EPA
- TC4425AVPAMicrochip Technology
8-DIP (0.300, 7.62mm)
8
-
4.5 A
-
35 ns
-
-
730 mW
TC4424AVPA
VS
TC4425AVPA
- MCP14E4-E/PMicrochip Technology
8-DIP (0.300, 7.62mm)
8
-
4 A
4 A
15 ns
-
-
1.1 W
TC4424AVPA
VS
MCP14E4-E/P
- ISL89410IPZIntersil (Renesas Electronics America)
PDIP
8
2
2 A
-
20 ns
4.5 V
18 V
-
TC4424AVPA
VS
ISL89410IPZ
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Microchip Technology's TC4424AVPA price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.