Infineon Technologies IR2131SPBF
IR2131SPBF
In Stock:94131
Qty
Unit Price
Ext Price
1
$6.670000
$6.670000
10
$6.296000
$62.960000
100
$5.939500
$593.950000
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Infineon Technologies IR2131SPBF information
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295, 7.50mm Width)
Number of Pins
28
Operating Temperature
-40°C~150°C TJ
Packaging
Tube
Published
1996
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
28
ECCN Code
EAR99
Resistance
75Ohm
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Subcategory
MOSFET Drivers
Max Power Dissipation
1.6W
Voltage - Supply
10V~20V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
3
Supply Voltage
15V
Terminal Pitch
1.27mm
Reflow Temperature-Max (s)
30
Base Part Number
IR2131SPBF
Number of Outputs
6
Output Voltage
620V
Max Output Current
500mA
Power Supplies
15V
Nominal Supply Current
4.5mA
Power Dissipation
1.6W
Output Current
250mA
Max Supply Current
4.5mA
Propagation Delay
2 μs
Input Type
Inverting
Turn On Delay Time
1.3 μs
Rise Time
150ns
Fall Time (Typ)
100 ns
Turn-Off Delay Time
600 ns
Rise / Fall Time (Typ)
80ns 40ns
Channel Type
Independent
Output Peak Current Limit-Nom
0.5A
Driven Configuration
Half-Bridge
Gate Type
IGBT, N-Channel MOSFET
Current - Peak Output (Source, Sink)
250mA 500mA
High Side Driver
YES
Logic Voltage - VIL, VIH
0.8V 2.2V
Turn Off Time
1 μs
High Side Voltage - Max (Bootstrap)
600V
Height
2.35mm
Length
18.0848mm
Width
7.5946mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
- Datasheets :
- Other Related Documents :
infineontechnologies-tda5200xuma1-otherrelateddocuments-8656.pdf
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
IR2131SPBF Overview
The 28-SOIC (0.295, 7.50mm Width) package provides greater flexibility.Tube represents the package.Surface Mount is mounted in the way.Gate drivers can demonstrate Gate driverss superiorGate driversy wGate driversh a 10V~20V supply voltage.Gate type IGBT, N-Channel MOSFET has been used in its design.This device is allowed to operate in a temperature range of -40°C~150°C TJ.Input type of Inverting is used.Its configuration starts with 28 terminations.There are numerous related parts listed under its base part number IR2131SPBF.The device is mounted with Surface Mount.During design, it is configured with 28 pins.The device is specifically designed to operate at 15V volts.There is a maximum output current of 500mA that can be achieved.There are various useful electronic components in its subcategory MOSFET Drivers.High-side voltage - Max (Bootstrap) can be as low as 600V.The basis of the model has 6 outputs integrated.The device is capable of delivering a current of 250mA.Its maximum power dissipation of 1.6W also demonstrates its maximum ability to transfer power without overheating.The supply current should be kept at 4.5mA to ensure higher stability.Due to its power supplies of 15V, it solves the power supply problem for a wide range of applications.Mosfet gate drivers produces a voltage of 620V.The system operates at a resistance of 75Ohm.
IR2131SPBF Features
Embedded in the Tube package
Employing a gate type of IGBT, N-Channel MOSFET
28 pins
High-side voltage - Max (Bootstrap) of 600V
Maximum power dissipation of 1.6W
Resistance of 75Ohm
IR2131SPBF Applications
There are a lot of Infineon Technologies IR2131SPBF gate drivers applications.
- Head-up and Head mounted displays
- DC-DC Converters
- Dual-Battery Systems
- Motor controllers
- Industrial Motor Inverter - Power Tools, Robotics
- 48 V to 12 V PoL Converters, 48 V to Low Voltage Bus Converter,
- Multicolor LED/laser displays
- Welding
- DC/DC converters
- White Goods - Air Conditioner, Washing Machine,
- ImagePart NumberManufacturerPackage / CaseNumber of PinsChannel TypeMax Output CurrentOutput CurrentRise TimeSupply VoltageMax Power DissipationView Compare
IR2131SPBF
Infineon Technologies28-SOIC (0.295, 7.50mm Width)
28
Independent
500 mA
250 mA
150 ns
15 V
1.6 W
- FAN73893MXON Semiconductor
28-SOIC (0.295, 7.50mm Width)
28
3-Phase
650 mA
-
-
-
1.4 W
IR2131SPBF
VS
FAN73893MX
- IRS2332DSTRPBFInfineon Technologies
28-SOIC (0.295, 7.50mm Width)
28
3-Phase
500 mA
200 mA
125 ns
15 V
1.6 W
IR2131SPBF
VS
IRS2332DSTRPBF
- IRS2332SPBFInfineon Technologies
28-SOIC (0.295, 7.50mm Width)
28
3-Phase
500 mA
200 mA
125 ns
15 V
1.6 W
IR2131SPBF
VS
IRS2332SPBF
- IRS2332STRPBFInfineon Technologies
28-SOIC (0.295, 7.50mm Width)
28
3-Phase
500 mA
200 mA
125 ns
15 V
1.6 W
IR2131SPBF
VS
IRS2332STRPBF
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Infineon Technologies's IR2131SPBF price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.