Linear Technology/Analog Devices LT3750EMS#TRPBF
LT3750EMS#TRPBF
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Linear Technology/Analog Devices LT3750EMS#TRPBF information
Type
Parameter
Factory Lead Time
8 Weeks
Lifecycle Status
PRODUCTION (Last Updated: 4 months ago)
Mounting Type
Surface Mount
Package / Case
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Surface Mount
YES
Number of Pins
10
Packaging
Tape & Reel (TR)
Published
2006
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
10
ECCN Code
EAR99
Type
Flyback, Forward Converter
Terminal Finish
Matte Tin (Sn)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Applications
Power Supply Controller
Subcategory
Power Management Circuits
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
5V
Terminal Pitch
0.5mm
Reflow Temperature-Max (s)
30
Base Part Number
LT3750
Pin Count
10
Number of Outputs
1
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
24V
Power Supplies
5V
Temperature Grade
COMMERCIAL
Supply Voltage-Min (Vsup)
3V
Supply Current-Max (Isup)
2.5mA
Height
860μm
Length
3mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Design Resources :
- PCN Design/Specification :
lineartechnologyanalogdevices-lt5401ahmsepbf-pcndesignspecification-1353.pdf
- Simulation Models :
- ConflictMineralStatement :
analogdeviceslineartechnology-lt5400bhms8e8trpbf-conflictmineralstatement-8771.pdf
LT3750EMS#TRPBF Overview
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) is the package that contains the ICs.This module is included in a package named Tape & Reel (TR).Surface Mount is used to mount integrated circuit.The Flyback, Forward Converter is available in a wide range of integrated circuits.The LT3750 family can be searched for similar integrated circuit systems.In the case of Power Supply Controller, it is appropriate for the ICs to be applied there.This ICs solutions has 10 terminations.The ICs applications has a total of 10 pins.In this case, the logic gate IC should be run at 5V.This is a logic IC that is recommended for use while the temperature is below 85°C.Temperatures below -40°C should not be allowed on the integrated circuit system.10 pins are on integrated circuit chip in total.It is important that the supply voltage (Vsup) of this integrated circuit system is not below 3V.It is recommended that the maximum supply voltage (Vsup) on this application specific integrated circuit do not exceed 24V.Power Management Circuits is the subcategory for this integrated circuit system.Voltage can be delivered at 5V.
LT3750EMS#TRPBF Features
Applications : Power Supply Controller
Supply power of 5V
LT3750EMS#TRPBF Applications
There are a lot of Linear Technology/Analog Devices LT3750EMS#TRPBF Specialized ICs applications.
- IoT Node Authentication
- Peripheral Authentication
- Message Security
- Secure Download and Boot
- Membrane Keypads
- Secure Management of Limited Use Consumables
- Reference Design License Management
- μP Switch Interfacing
- Anti-cloning
- Portable Instruments
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of OutputsTerminal PitchLengthTerminal PositionPeak Reflow Temperature (Cel)View Compare
LT3750EMS#TRPBF
Linear Technology/Analog Devices10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
10
1
0.5 mm
3 mm
DUAL
260
TPS54160DGQNA10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
10
1
0.5 mm
3 mm
DUAL
260
LT3750EMS#TRPBF
VS
TPS54160DGQ
NCP1423DMR2GON Semiconductor10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
10
1
0.5 mm
3 mm
DUAL
260
LT3750EMS#TRPBF
VS
NCP1423DMR2G
- TPS40210DGQNA
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
10
1
0.5 mm
3 mm
DUAL
260
LT3750EMS#TRPBF
VS
TPS40210DGQ
- LM5020MM-1/NOPBNA
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
10
1
0.5 mm
3 mm
DUAL
260
LT3750EMS#TRPBF
VS
LM5020MM-1/NOPB
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
