ROHM Semiconductor BU4913FVE-TR
BU4913FVE-TR
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ROHM Semiconductor BU4913FVE-TR information
Type
Parameter
Factory Lead Time
9 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
SOT-665
Number of Pins
5
Operating Temperature
-40°C~125°C TA
Packaging
Tape & Reel (TR)
Published
2009
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
5
ECCN Code
EAR99
Type
Simple Reset/Power-On Reset
Subcategory
Power Management Circuits
Max Power Dissipation
210mW
Technology
CMOS
Terminal Position
DUAL
Terminal Form
FLAT
Number of Functions
1
Supply Voltage
2.4V
Base Part Number
BU4913
Output
Push-Pull, Totem Pole
Pin Count
5
Number of Channels
1
Max Supply Voltage
7V
Min Supply Voltage
700mV
Operating Supply Current
550nA
Max Supply Current
880nA
Adjustable Threshold
NO
Quiescent Current
300nA
Accuracy
1 %
Watchdog Timer
No
Reset
Active High/Active Low
Voltage - Threshold
1.3V
Number of Voltages Monitored
1
Min Reset Threshold Voltage
1.287V
Max Reset Threshold Voltage
1.313V
Threshold Voltage
+1.3V
Undervoltage Threshold
1.287V
Overvoltage Threshold
1.313V
Height Seated (Max)
0.6mm
RoHS Status
ROHS3 Compliant
BU4913FVE-TR Overview
There are 5 mounting terminals on the voltage supervisor, each of which has a different function. Power management is packaged in a Tape & Reel (TR) way. Please find attached 1 functions for your reference in this IC power. Depending on the power managment ic you are looking at, you can find a total of 1 channels. IC management is packaged as a SOT-665 package. Several of the benefits of this PMIC are also shared by other Simple Reset/Power-On Reset products. In a 2.4V supply voltage, the power management conducts. IC management conducts in a 1-voltage supply. Surface Mount mounts IC management. This power ic can be sub-categorized as Power Management Circuits. The total number of pins on this power management is 5. There are 5 pins on the supervisor. In order for this PMIC to work correctly, the minimum supply voltage (Vsup) should be greater than 700mV. In this PMIC, the maximum supply voltage (Vsup) should not exceed 7V volts. Mounting type Surface Mount is recommended. It is recommended that the supervisor be set to this temperature: -40°C~125°C TA. As this power managment ic operates, it is able to produce an output voltage of Push-Pull, Totem Pole. For this power management, there is an 550nA volt supply current. A similar IC managements number of the manufacturer can always be found by using BU4913, the base power ics number. At most, voltage supervisor can operate at a supply temperature of 880nA.
BU4913FVE-TR Features
Simple Reset/Power-On Reset type
Minimum supply voltage of 700mV
550nA operating supply current
BU4913FVE-TR Applications
There are a lot of ROHM Semiconductor BU4913FVE-TR Voltage Supervisors applications.
- Power distribution systems of operating room
- Electronics installed in the vehicle
- emergency room
- Network equipment
- Military electronics
- Display equipment
- Consumer electronics
- Power communication system
- Leakage current detection
- Sensitive sensors
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Voltages MonitoredResetOvervoltage ThresholdUndervoltage ThresholdThreshold VoltageWatchdog TimerMin Supply VoltageSupply VoltageView Compare
BU4913FVE-TR
ROHM SemiconductorSOT-665
5
1
Active High/Active Low
1.313 V
1.287 V
+1.3V
No
700 mV
2.4 V
NCP303LSN11T1GON SemiconductorSOT-23-5 Thin, TSOT-23-5
5
1
Active Low
1.122 V
1.078 V
+1.1V
No
800 mV
1.5 V
BU4913FVE-TR
VS
NCP303LSN11T1G
BU4913G-TRROHM SemiconductorSC-74A, SOT-753
5
1
Active High/Active Low
1.313 V
1.287 V
+1.3V
No
700 mV
2.4 V
BU4913FVE-TR
VS
BU4913G-TR
- BU4813G-TRROHM Semiconductor
SC-74A, SOT-753
5
1
Active High/Active Low
1.313 V
1.287 V
+1.3V
No
700 mV
2.4 V
BU4913FVE-TR
VS
BU4813G-TR
- BU4813FVE-TRROHM Semiconductor
SOT-665
5
1
Active High/Active Low
1.313 V
1.287 V
+1.3V
No
700 mV
2.4 V
BU4913FVE-TR
VS
BU4813FVE-TR
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2.Are the ROHM Semiconductor's BU4913FVE-TR price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
