Maxim Integrated MAX708SESA+
MAX708SESA+
In Stock:94131
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Maxim Integrated MAX708SESA+ information
Type
Parameter
Factory Lead Time
6 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Published
2010
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Type
Simple Reset/Power-On Reset
Terminal Finish
Matte Tin (Sn)
Additional Feature
MANUAL RESET, POWER FAIL COMPARATOR
Subcategory
Power Management Circuits
Max Power Dissipation
470.6mW
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Base Part Number
MAX708
Output
Push-Pull, Push-Pull
Pin Count
8
Power Supplies
3.3/5V
Number of Channels
1
Max Supply Voltage
5.5V
Min Supply Voltage
1.2V
Operating Supply Current
135μA
Adjustable Threshold
NO
Watchdog Timer
No
Reset
Active High/Active Low
Voltage - Threshold
2.93V
Number of Voltages Monitored
1
Reset Timeout
140ms Minimum
Supply Current-Max (Isup)
0.5mA
Min Reset Threshold Voltage
2.85V
Max Reset Threshold Voltage
3V
Undervoltage Threshold
2.85V
Overvoltage Threshold
3V
Height
1.5mm
Length
5mm
Width
4mm
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- ConflictMineralStatement :
maximintegrated-ds1075z66n-conflictmineralstatement-7504.pdf
MAX708SESA+ Overview
This power management consists of 8 mounting terminals on which it can be mounted. It is packaged with Tube. To assist you, this IC power includes 1 functions. There are 1 channels on this power managment ic that can be found in a series. Please find attached 8-SOIC (0.154, 3.90mm Width) functions for your reference in this IC power. As with other Simple Reset/Power-On Reset products, this IC management also offers a wide range of benefits. Specifies a reflow peak temperature of 260 for the package during reflow. There is a voltage supply of 3V for the PMIC chip, and the chip conducts at that voltage. During operation, the power ic is supplied with a voltage of 1. The mount is attached to Surface Mount. In this case, this PMIC chip can be sub-categorized as a Power Management Circuits chip. It has a total of 8 pins that are attached to IC management. Pin count of the power management is 8. In order for this PMIC to work correctly, the minimum supply voltage (Vsup) should be greater than 1.2V. The maximum supply voltage (Vsup) is not to exceed 5.5V volts in this IC management. Power management' mounting is recommended to be done with the Surface Mount type of mounting. The supervisors should be set to the following temperature: -40°C~85°C TA. There is an output voltage of Push-Pull, Push-Pull from this supervisor when it is operating. The power management's supply current is 135μA. There are also other features in the software such as [0], just to mention a few. If you want to search for similar IC managements of this manufacturer, you can always refer to MAX708, which is the base power ics number. The voltage supervisor requires a power source of 3.3/5V volts in order to work correctly.
MAX708SESA+ Features
Simple Reset/Power-On Reset type
Minimum supply voltage of 1.2V
135μA operating supply current
MAX708SESA+ Applications
There are a lot of Maxim Integrated MAX708SESA+ Voltage Supervisors applications.
- Analog circuit
- Urban rail transit weak current power monitoring
- Data storage applications
- Smartphones
- Important electronics for automotive safety
- Precision measurement
- Electric heating appliances
- Insulation fault location system
- Leakage current detection
- Power distribution systems of infant care room
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of Voltages MonitoredResetReset TimeoutOvervoltage ThresholdUndervoltage ThresholdWatchdog TimerMin Supply VoltageSupply VoltageView Compare
MAX708SESA+
Maxim Integrated8-SOIC (0.154, 3.90mm Width)
8
1
Active High/Active Low
140ms Minimum
3 V
2.85 V
No
1.2 V
3 V
MAX708RESA-TGON Semiconductor8-SOIC (0.154, 3.90mm Width)
8
1
Active High/Active Low
140ms Minimum
2.67 V
2.63 V
No
1 V
3.3 V
MAX708SESA+
VS
MAX708RESA-TG
- DS1708SESAMaxim Integrated
8-SOIC (0.154, 3.90mm Width)
8
1
Active High/Active Low
130ms Minimum
3 V
2.85 V
No
1.2 V
3.3 V
MAX708SESA+
VS
DS1708SESA
- MAX708SCSA+TMaxim Integrated
8-SOIC (0.154, 3.90mm Width)
8
1
Active High/Active Low
140ms Minimum
3 V
2.85 V
No
1 V
3 V
MAX708SESA+
VS
MAX708SCSA+T
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MAX708SCSAMaxim IntegratedSOIC
8
1
Active High/Active Low
140 ms
3 V
2.85 V
-
1 V
3 V
MAX708SESA+
VS
MAX708SCSA
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the ND-2's MAX708SESA+ price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
