Microchip Technology MCP23S17T-E/SS
MCP23S17T-E/SS
In Stock:94131
Qty
Unit Price
Ext Price
1
$3.520000
$3.520000
10
$3.319000
$33.190000
100
$3.131500
$313.150000
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Microchip Technology MCP23S17T-E/SS information
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mounting Type
Surface Mount
Package / Case
28-SSOP (0.209, 5.30mm Width)
Surface Mount
YES
Number of Pins
28
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
Published
2005
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
28
ECCN Code
EAR99
Subcategory
Parallel IO Port
Technology
CMOS
Voltage - Supply
1.8V~5.5V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
5V
Terminal Pitch
0.65mm
Reflow Temperature-Max (s)
40
Base Part Number
MCP23S17
Pin Count
28
Qualification Status
Not Qualified
Output Type
Push-Pull
Power Supplies
5V
Number of Channels
1
Interface
SPI
Number of I/O
16
Number of Ports
2
Nominal Supply Current
1mA
Power Dissipation
700mW
Output Current
25mA
uPs/uCs/Peripheral ICs Type
PARALLEL IO PORT, GENERAL PURPOSE
Number of Bits
16
Clock Frequency
10MHz
Interrupt Output
Yes
Height Seated (Max)
2mm
Width
5.3mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
MCP23S17T-E/SS Overview
16 I/Os are programmed into it.28-SSOP (0.209, 5.30mm Width) packaging contains the device.The case comes in the form of a Tape & Reel (TR).In this case, the vote is supplied within the range of 1.8V~5.5V.The recommended mounting type is Surface Mount, which makes it suitable for most applications.In operation, the device works when the temperature ranges between -40°C~125°C and X.For the performance of the output frequency, it works at 10MHz.As a whole, it has terminations on the 28 axis.Total pin count on the part is 28.The device provides voltage at 5V.It is utilized to run 260 on this part due to its peak reflow temperature.The device has a total of 2 ports.You can look for related parts based on the MCP23S17 family.A chip with 16 bits has a total of 16 bits.This can deliver the power to 5V in a very efficient manner.28 pins are present on the device.It belongs to the PARALLEL IO PORT, GENERAL PURPOSE uPs/uCs/Peripheral ICs Type.This is a model from the Parallel IO Port series.A device can be supplied with a maximum current of 25mA.1 channels are available on the device.
MCP23S17T-E/SS Features
MCP23S17T-E/SS Applications
There are a lot of Microchip Technology MCP23S17T-E/SS I/O Expanders applications.
- Servo-loops
- Chebyshev filter
- Cordless phones
- Elliptic filter
- Modems
- Multi-function filters
- Butterworth filter
- Cellular phone
- First order active low-pass filters
- Dual amplifiaer band pass (DABP)
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInterfaceSupply VoltageRoHS StatusLead FreeTerminal PositionTerminal FormView Compare
MCP23S17T-E/SS
Microchip Technology28-SSOP (0.209, 5.30mm Width)
28
SPI
5 V
ROHS3 Compliant
Lead Free
DUAL
GULL WING
- TPS2220ADBRNA
24-SSOP (0.209, 5.30mm Width)
24
Serial
3.3 V
ROHS3 Compliant
Lead Free
DUAL
GULL WING
MCP23S17T-E/SS
VS
TPS2220ADBR
- MCP23S17-E/SSMicrochip Technology
28-SSOP (0.209, 5.30mm Width)
28
SPI
5 V
ROHS3 Compliant
Lead Free
DUAL
GULL WING
MCP23S17T-E/SS
VS
MCP23S17-E/SS
- MCP23017-E/SSMicrochip Technology
28-SSOP (0.209, 5.30mm Width)
28
I2C
5 V
ROHS3 Compliant
Lead Free
DUAL
GULL WING
MCP23S17T-E/SS
VS
MCP23017-E/SS
- MCP2210-I/SSMicrochip Technology
20-SSOP (0.209, 5.30mm Width)
20
SPI
3 V
ROHS3 Compliant
Lead Free
DUAL
GULL WING
MCP23S17T-E/SS
VS
MCP2210-I/SS
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
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3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.