Microchip Technology MCP23S17T-E/SO
MCP23S17T-E/SO
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Microchip Technology MCP23S17T-E/SO information
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
28-SOIC (0.295, 7.50mm Width)
Number of Pins
28
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
Published
2005
JESD-609 Code
e3
Feature
POR
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
28
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Technology
CMOS
Voltage - Supply
1.8V~5.5V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
250
Supply Voltage
5V
Reflow Temperature-Max (s)
40
Base Part Number
MCP23S17
Pin Count
28
Qualification Status
Not Qualified
Output Type
Push-Pull
Power Supplies
5V
Number of Channels
1
Interface
SPI
Number of I/O
16
Number of Ports
2
Nominal Supply Current
1mA
Power Dissipation
700mW
Number of Bits
16
Clock Frequency
10MHz
Interrupt Output
Yes
Current - Output Source/Sink
25mA
Height Seated (Max)
2.65mm
Width
7.5mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
MCP23S17T-E/SO Overview
It features 16 I/Os.There is a 28-SOIC (0.295, 7.50mm Width) that comes with the device, which is enclosed in the packaging.The case comes in the form of a Tape & Reel (TR).Voting is done within 1.8V~5.5V hours after the order is placed.The mounting type it recommends is Surface Mount.A device works when its operating temperature ranges from -40°C~125°C to -40°C~125°C.Performance is achieved by its output frequency at 10MHz.As a whole, it has terminations on the 28 axis.28 pins make up the part.5V provides voltage to the device.To run 250, the peak reflow temperature is taken into account.The device has a total of 2 ports.The MCP23S17 family contains related parts that you can search for.With the help of this device, it is also possible to establish POR.16 is the number of bits on an IC chip.At 5V, it is capable of delivering power.This device is equipped with 28 pins.It is possible to mount the part using Surface Mount.In this device, there are 1 channels.
MCP23S17T-E/SO Features
MCP23S17T-E/SO Applications
There are a lot of Microchip Technology MCP23S17T-E/SO I/O Expanders applications.
- Cardiac pacemakers
- Display Serial Interface (DSI)
- PMP/MP3 Players
- Portable Media Players (PMP)
- Bluetooth-enabled mobile communications devices
- Data Loggers
- Low Voltage, Low Noise, Differential Signal Processing
- Audio/Sonar/Avionics frequency filtering
- Active crossover networks
- Differential A/D Converter Driver
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInterfaceSupply VoltageTechnologyPart StatusMoisture Sensitivity Level (MSL)Terminal FormView Compare
MCP23S17T-E/SO
Microchip Technology28-SOIC (0.295, 7.50mm Width)
28
SPI
5 V
CMOS
Active
1 (Unlimited)
GULL WING
PCA9555D,112NXP USA Inc.24-SOIC (0.295, 7.50mm Width)
-
I2C, SMBus
3 V
CMOS
Active
1 (Unlimited)
GULL WING
MCP23S17T-E/SO
VS
PCA9555D,112
HV5812WG-GMicrochip Technology28-SOIC (0.295, 7.50mm Width)
28
Serial
5 V
CMOS
Active
1 (Unlimited)
GULL WING
MCP23S17T-E/SO
VS
HV5812WG-G
- MCP23017-E/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
I2C
5 V
CMOS
Active
1 (Unlimited)
GULL WING
MCP23S17T-E/SO
VS
MCP23017-E/SO
- MCP23S17-E/SOMicrochip Technology
28-SOIC (0.295, 7.50mm Width)
28
SPI
5 V
CMOS
Active
1 (Unlimited)
GULL WING
MCP23S17T-E/SO
VS
MCP23S17-E/SO
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2.Are the Microchip Technology's MCP23S17T-E/SO price and stock displayed on the website accurate?
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You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
