Texas Instruments LM311P
LM311P
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Texas Instruments LM311P information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Through Hole
Package / Case
8-DIP (0.300, 7.62mm)
Number of Pins
8
Weight
2.012816mg
Operating Temperature
0°C~70°C
Packaging
Tube
Tolerance
1%
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Type
General Purpose
Resistance
390Ohm
Voltage - Rated
75V
Subcategory
Comparator
Power Rating
100mW
Max Power Dissipation
500mW
Technology
BIPOLAR
Terminal Position
DUAL
Number of Functions
1
Supply Voltage
15V
Terminal Pitch
2.54mm
Base Part Number
LM311
Pin Count
8
Case Code (Metric)
1608
Case Code (Imperial)
0603
Output Type
DTL, MOS, Open-Collector, Open-Emitter, RTL, TTL
Operating Supply Voltage
28V
Number of Circuits
1
Nominal Supply Current
7.5mA
Output Current
50mA
Max Supply Current
7.5mA
Propagation Delay
115 ns
Quiescent Current
7.5mA
Turn On Delay Time
115 ns
Max Output Voltage
7.5mV
Response Time
165 ns
Voltage - Supply, Single/Dual (±)
3.5V~30V ±1.75V~15V
Output Current per Channel
50mA
Input Offset Voltage (Vos)
7.5mV
Neg Supply Voltage-Nom (Vsup)
-15V
Voltage Gain
106.02dB
Average Bias Current-Max (IIB)
0.25μA
Max Input Current
250nA
Dual Supply Voltage
9V
Input Bias Current
250nA
Voltage - Input Offset (Max)
7.5mV @ ±15V
Current - Input Bias (Max)
0.25μA @ ±15V
Height
5.08mm
Length
9.81mm
Width
6.35mm
Thickness
3.9mm
Radiation Hardening
No
REACH SVHC
Unknown
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- Datasheets :
LM311P Description
The LM311P is single high-speed voltage comparator. These devices are designed to operate from a wide range of power-supply voltages, including ±15-V supplies for operational amplifiers and 5-V supplies for logic systems. The output levels are compatible with most TTL and MOS circuits. These comparators are capable of driving lamps or relays and switching voltages up to 50 V at 50 mA. All inputs and outputs can be isolated from system ground. The outputs can drive loads referenced to ground, VCC+ or VCC?. Offset balancing and strobe capabilities are available, and the outputs can be wire-OR connected. If the strobe is low, the output is in the off state, regardless of the differential input.
LM311P Features
Fast Response Times
Strobe Capability
Maximum Input Bias Current: 300 nA
Maximum Input Offset Current: 70 nA
Can Operate From Single 5-V Supply
Available in Q-Temp Automotive
ROHS3 Compliant
Lead Free
LM311P Applications
Zero-Crossing Detector
Detector for Magnetic Transducer
Comparator and Solenoid Driver
Precision Squarer
Digital Transmission Isolator
Positive-Peak Detector
Precision Photodiode Comparator
Switching Power Amplifier
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CircuitsInput Offset Voltage (Vos)Supply VoltageNumber of TerminationsPbfree CodeSubcategoryView Compare
LM311P
NA8-DIP (0.300, 7.62mm)
8
1
7.5 mV
15 V
8
yes
Comparator
- LM2903NGON Semiconductor
8-DIP (0.300, 7.62mm)
8
2
7 mV
5 V
8
yes
Comparator
LM311P
VS
LM2903NG
- LM311NGON Semiconductor
8-DIP (0.300, 7.62mm)
8
1
7.5 mV
15 V
8
yes
Comparator
LM311P
VS
LM311NG
- LM2903PNA
8-DIP (0.300, 7.62mm)
8
2
7 mV
5 V
8
yes
Comparator
LM311P
VS
LM2903P
- LM311PE4NA
PDIP
8
-
7.5 mV
15 V
8
yes
Comparator
LM311P
VS
LM311PE4
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s LM311P price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history:
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.