Texas Instruments LM2901DR
LM2901DR
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.230000
$0.230000
10
$0.220000
$2.200000
100
$0.207700
$20.770000
500
$0.195960
$97.980000
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Texas Instruments LM2901DR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 5 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154, 3.90mm Width)
Number of Pins
14
Weight
122.413241mg
Operating Temperature
-40°C~125°C
Packaging
Cut Tape (CT)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
ECCN Code
EAR99
Type
General Purpose
Subcategory
Comparator
Packing Method
TR
Technology
BIPOLAR
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
4
Supply Voltage
5V
Terminal Pitch
1.27mm
Base Part Number
LM2901
Pin Count
14
Output Type
CMOS, MOS, Open-Collector, TTL
Operating Supply Voltage
28V
Power Supplies
5V
Number of Circuits
4
Nominal Supply Current
2mA
Output Current
20mA
Max Supply Current
500μA
Quiescent Current
2.5mA
Response Time
1.3 μs
Voltage - Supply, Single/Dual (±)
2V~30V ±1V~15V
Output Current per Channel
6mA
Input Offset Voltage (Vos)
7mV
Voltage Gain
100dB
Average Bias Current-Max (IIB)
0.25μA
Supply Voltage Limit-Max
36V
Max Input Current
250nA
Dual Supply Voltage
9V
Input Bias Current
250nA
Voltage - Input Offset (Max)
7mV @ 30V
Current - Input Bias (Max)
0.25μA @ 5V
Height
1.75mm
Length
8.65mm
Width
3.91mm
Thickness
1.58mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- PCN Assembly/Origin :
- Datasheets :
LM2901DR Overview
A convenient packaging is provided in the form of 14-SOIC (0.154, 3.90mm Width) .The comparator has a type CMOS, MOS, Open-Collector, TTL output.As a result, it is designed with Cut Tape (CT) package.As you can see, the comparator has14 terminals.The chip belongs to Comparator .The comparator is capable of achieving many demanding tasks when supplied with 5V voltage.In general, the chip type can be classified as General Purpose .Electronic comparator has 14 pins.Electronic comparator is recommended to mount the device using type Surface Mount .The operating temperature should be set to -40°C~125°C to avoid mal-function.There are 14 pins on the comparator.In case you are looking for more pin-to-pin solutions, you may want to search LM2901 .There is a quiescent current of 2.5mA in this comparator.The PCB or other board has a Surface Mount for mounting.Electronic comparator is recommended that the nominal supply current of the device be 2mA .A current supply greater than 500μA may cause the comparator to malfunction.The device can be powered by 5V power supplies.Electronic comparator is possible to input a maximum current of 250nA into the device.A voltage gain of 100dB can be determined from the voltage formula for the part.Comparator electronics is necessary to have a voltage of 28V for normal operation.Comparator electronics is acceptable to pack the device by TR .
LM2901DR Features
CMOS, MOS, Open-Collector, TTL output capability
General Purpose IC
Operates under -40°C~125°C
Quiescent Current: 2.5mA
Voltage Gain: 100dB
LM2901DR Applications
There are a lot of Texas Instruments LM2901DR linear comparators applications.
- Mobile Communications
- Appliances
- General-Purpose Portable Devices
- Automatic Test Equipment
- Motor drives
- Consumer Medical Electronics
- Zero-Crossing Detectors
- Industrial
- Zero-Crossing Detectors
- Point of load regulators
- ImagePart NumberManufacturerPackage / CaseNumber of PinsInput Offset Voltage (Vos)Supply VoltageNominal Supply CurrentTerminal PitchCurrent - Input Bias (Max)Power SuppliesView Compare
LM2901DR
NA14-SOIC (0.154, 3.90mm Width)
14
7 mV
5 V
2 mA
1.27 mm
0.25μA @ 5V
5 V
LM2901YDTSTMicroelectronics14-SOIC (0.154, 3.90mm Width)
14
7 mV
5 V
2 mA
1.27 mm
0.25μA @ 5V
5 V
LM2901DR
VS
LM2901YDT
- LM2901DNA
14-SOIC (0.154, 3.90mm Width)
14
2 mV
5 V
2 mA
1.27 mm
0.25μA @ 5V
5 V
LM2901DR
VS
LM2901D
- LM2901DRG4NA
14-SOIC (0.154, 3.90mm Width)
14
7 mV
5 V
2 mA
1.27 mm
0.25μA @ 5V
5 V
LM2901DR
VS
LM2901DRG4
- LM2901DRG3NA
14-SOIC (0.154, 3.90mm Width)
14
7 mV
5 V
2 mA
1.27 mm
0.25μA @ 5V
5 V
LM2901DR
VS
LM2901DRG3
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s LM2901DR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
