Texas Instruments DAC8830IBDR
DAC8830IBDR
In Stock:94131
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Texas Instruments DAC8830IBDR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Contact Plating
Gold
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Number of Pins
8
Weight
75.891673mg
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
8
ECCN Code
EAR99
Subcategory
Other Converters
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Base Part Number
DAC8830
Pin Count
8
Output Type
Voltage - Unbuffered
Polarity
Unipolar
Power Supplies
3/5V
Max Supply Voltage
5.5V
Min Supply Voltage
2.7V
Nominal Supply Current
5μA
Number of Bits
16
Architecture
R-2R
Converter Type
D/A CONVERTER
Supply Type
Single
Reference Type
External
Data Interface
SPI
Differential Output
No
Resolution
2 B
Sampling Rate
1 Msps
Voltage - Supply, Analog
2.7V~5.5V
Voltage - Supply, Digital
2.7V~5.5V
Settling Time
1μs (Typ)
Integral Nonlinearity (INL)
2 LSB
Input Bit Code
BINARY
Number of Converters
1
Conversion Rate
1 Msps
INL/DNL (LSB)
±0.5, ±0.5
Signal to Noise Ratio (SNR)
92 dB
Input Format
SERIAL
Analog Output Voltage-Max
2.5V
Differential Nonlinearity
1 LSB
Height
1.75mm
Length
4.9mm
Width
3.91mm
Thickness
1.58mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
DAC8830IBDR Overview
It is supplied in the 8-SOIC (0.154, 3.90mm Width) package. It is powered from a supply voltage of 3V. Part of the Other Converters family, this FPGA part is a programmable gate array. This FPGA module can be attached to the development board with a Surface Mount. The operating temperature should be kept at -40°C~85°C when operating. As a result of space limitations, this FPGA model has been included in Tape & Reel (TR). Total terminations are 8. You can find related parts by using the part number DAC8830, which is its base part number. The device is designed with 8 pins in total. Power is provided by a 3/5V battery that is included with the device. Featuring 8 pins in total, it is a versatile device. This device is capable of supporting a maximum supply voltage of 5.5V. The unit is capable of working with a minimum supply voltage of 2.7V.
DAC8830IBDR Features
8-SOIC (0.154, 3.90mm Width) package
8 pin count
8 pins
DAC8830IBDR Applications
There are a lot of Texas Instruments DAC8830IBDR Digital to Analog Converters (DAC)?applications.
- Precision AGC Circuits
- Basestations
- Data Acquisition
- General Purpose Trimming Adjustments
- Wireless infrastructure:
- Data Acquisition Systems
- Video Encoder
- Low bandwidth data acquisition systems
- LMDS/MMDS, point-to-point
- Gain and offset adjustment
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of BitsSettling TimeIntegral Nonlinearity (INL)Min Supply VoltageSupply VoltageMax Supply VoltageView Compare
DAC8830IBDR
NA8-SOIC (0.154, 3.90mm Width)
8
16
1μs (Typ)
2 LSB
2.7 V
3 V
5.5 V
- TLV5638QDRG4NA
8-SOIC (0.154, 3.90mm Width)
8
12
7μs
6 LSB
2.7 V
3 V
5.5 V
DAC8830IBDR
VS
TLV5638QDRG4
- TLV5638QDG4NA
8-SOIC (0.154, 3.90mm Width)
8
12
7μs
6 LSB
2.7 V
3 V
5.5 V
DAC8830IBDR
VS
TLV5638QDG4
- TLV5606IDRNA
8-SOIC (0.154, 3.90mm Width)
8
10
20μs
1.5 LSB
2.7 V
3 V
5.5 V
DAC8830IBDR
VS
TLV5606IDR
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Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s DAC8830IBDR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
