Texas Instruments DAC084S085CIMM/NOPB
DAC084S085CIMM/NOPB
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Texas Instruments DAC084S085CIMM/NOPB information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
Number of Pins
10
Operating Temperature
-40°C~105°C
Packaging
Tape & Reel (TR)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
10
Termination
SMD/SMT
ECCN Code
EAR99
Subcategory
Other Converters
Max Power Dissipation
1.1mW
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Terminal Pitch
0.5mm
Base Part Number
DAC084S085
Pin Count
10
Output Type
Voltage - Buffered
Operating Supply Voltage
5V
Polarity
Unipolar
Interface
I2C, SPI, Serial
Max Supply Voltage
5.5V
Min Supply Voltage
2.7V
Nominal Supply Current
500μA
Number of Bits
8
Architecture
String DAC
Converter Type
D/A CONVERTER
Supply Type
Single
Reference Type
External
Data Interface
SPI, DSP
Differential Output
No
Resolution
1 B
Sampling Rate
1.7 Msps
Voltage - Supply, Analog
2.7V~5.5V
Voltage - Supply, Digital
2.7V~5.5V
Settling Time
4.5μs
Power Consumption
1.1mW
Integral Nonlinearity (INL)
0.5 LSB
Input Bit Code
BINARY
Number of Converters
1
INL/DNL (LSB)
±0.14, +0.04 (Max)
Number of D/A Converters
4
Height
1.07mm
Length
3mm
Width
3mm
Thickness
1.02mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- PCN Design/Specification :
- Datasheets :
DAC084S085CIMM/NOPB Overview
There is a 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) package that includes this component. It is powered from a supply voltage of 3V. There is a Other Converters family component in this FPGA part. FPGA modules can be attached to development boards using a Surface Mount-connector. As far as the operating temperature is concerned, it should be kept within -40°C~105°C when operating. It is for space saving reasons that this FPGA model is contained in Tape & Reel (TR). In total, there are a total of 10 terminations on it. For related parts, use its base part number DAC084S085. In this case, 10 pins are used in the design. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. The 5V supply voltage provides designers with full flexibility in their designs. As far as the pin count is concerned, it has 10 pins. It supports the maximal supply voltage of 5.5V. Using a supply voltage as low as 2.7V, it will work.
DAC084S085CIMM/NOPB Features
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) package
10 pin count
10 pins
DAC084S085CIMM/NOPB Applications
There are a lot of Texas Instruments DAC084S085CIMM/NOPB Digital to Analog Converters (DAC)?applications.
- Portable Equipment
- Industrial Control Systems
- General Purpose Trimming Adjustments
- Digital Radio Link
- Software Radio
- Portable battery-powered instruments
- Video Encoder
- Precision AGC Circuits
- Data Distribution System
- Function Generaion
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of BitsSettling TimeInterfaceIntegral Nonlinearity (INL)PolarityMin Supply VoltageSupply VoltageView Compare
DAC084S085CIMM/NOPB
NA10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
10
8
4.5μs
I2C, SPI, Serial
0.5 LSB
Unipolar
2.7 V
3 V
DAC5574IDGSRNA10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
10
8
12μs (Typ)
-
0.5 LSB
Unipolar
2.7 V
3 V
DAC084S085CIMM/NOPB
VS
DAC5574IDGSR
DAC081C085CIMM/NOPBNA8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
-
8
4.5μs
-
0.6 LSB
Unipolar
2.7 V
3 V
DAC084S085CIMM/NOPB
VS
DAC081C085CIMM/NOPB
- DAC082S085CIMMX/NOPBNA
10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
10
8
4.5μs
SPI
0.5 LSB
Unipolar
2.7 V
3 V
DAC084S085CIMM/NOPB
VS
DAC082S085CIMMX/NOPB
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s DAC084S085CIMM/NOPB price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
