ON Semiconductor FSA831AL10X
FSA831AL10X
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ON Semiconductor FSA831AL10X information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE, NOT REC (Last Updated: 1 week ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
10-UFQFN Exposed Pad
Number of Pins
10
Weight
26mg
Operating Temperature
-40°C~85°C TA
Packaging
Tape & Reel (TR)
Published
2016
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
10
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Power Management Circuits
Terminal Position
BOTTOM
Terminal Form
BUTT
Supply Voltage
5V
Terminal Pitch
0.6mm
Base Part Number
FSA831
Function
Multi-Function Controller
Number of Outputs
1
Output Voltage
6V
Operating Supply Voltage
6V
Power Supplies
5V
Number of Channels
1
Interface
USB
Analog IC - Other Type
POWER SUPPLY SUPPORT CIRCUIT
Output Current
2mA
Adjustable Threshold
NO
Min Input Voltage
4V
Max Input Voltage
6V
Fault Protection
Over Voltage
Height
500μm
Length
2.1mm
Width
1.6mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Design/Specification :
- PCN Assembly/Origin :
- PCN Packaging :
- TechnicalDrawing :
- ReachStatement :
FSA831AL10X Overview
The 10-UFQFN Exposed Pad package is suitable for battery instrument. IC POWER SUPPLY SUPPORT CIRCUIT is the system battery's analog IC. A total of 1 channels are available. 10 pins are on it. The smart tools battery is packaged in a Tape & Reel (TR) case. The electrical component must be mounted with Surface Mount. An electrical component of the type Power Management Circuits can be found here. Surface Mount is in the way of this electronic component. A Multi-Function Controller function can be delivered by battery instrument. It is best for the electric part to operate temperature at the range of -40°C~85°C TA to deliver its performance. It is powered by a 5V volts. It is always recommended that this battery protection IC is set to 5V. Based on the FSA831 family. For this smart tools battery, the operating supply voltage is specified as being in the range of 6V. A chip input voltage of 6V can be used to power it. It is possible to run the battery protector ic above 4V by lowering the input voltage. It is possible to supply the battery management IC with a maximum current of 2mA. There is a electrical component configured with 1 outputs.
FSA831AL10X Features
Available in 10-UFQFN Exposed Pad Package
with 10 Pins
Mounting Type: Surface Mount
operate supply voltage at the range of 5V
Output Voltage at the range of 6V
With 1 outputs
FSA831AL10X Applications
There are a lot of ON Semiconductor FSA831AL10X Battery Management ICs applications.
- Buses
- Motor drive - 3 phase AC400V inverter
- Providing battery protection
- Utility vehicles
- Ventilator
- Weather stations
- Rear light with dynamic control
- PV inverter
- Hybrid electric vehicles
- Motor drive - single phase AC100V-240V non -isolated
- ImagePart NumberManufacturerPackage / CaseNumber of PinsOutput VoltageOutput CurrentSupply VoltageSubcategoryMountAnalog IC - Other TypeView Compare
FSA831AL10X
ON Semiconductor10-UFQFN Exposed Pad
10
6 V
2 mA
5 V
Power Management Circuits
Surface Mount
POWER SUPPLY SUPPORT CIRCUIT
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8-VDFN Exposed Pad
8
4.3 V
85 μA
7.2 V
Power Management Circuits
Surface Mount
POWER SUPPLY SUPPORT CIRCUIT
FSA831AL10X
VS
BQ29209TDRBRQ1
- MCP73833T-AMI/MFMicrochip Technology
10-VFDFN Exposed Pad
10
4.5 V
1.2 A
-
Power Management Circuits
Surface Mount
POWER SUPPLY SUPPORT CIRCUIT
FSA831AL10X
VS
MCP73833T-AMI/MF
- MCP73831T-2ATI/MCMicrochip Technology
8-VFDFN Exposed Pad
8
4.2 V
500 mA
5.2 V
Power Management Circuits
Surface Mount
POWER SUPPLY SUPPORT CIRCUIT
FSA831AL10X
VS
MCP73831T-2ATI/MC
- MCP73834-NVI/MFMicrochip Technology
10-VFDFN Exposed Pad
10
4.5 V
1.2 A
5.35 V
Power Management Circuits
Surface Mount
POWER SUPPLY SUPPORT CIRCUIT
FSA831AL10X
VS
MCP73834-NVI/MF
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2.Are the ON Semiconductor's FSA831AL10X price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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How to pack electronic components in cartons?
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4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.