ON Semiconductor NCV78663DQ0R2G
NCV78663DQ0R2G
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ON Semiconductor NCV78663DQ0R2G information
Type
Parameter
Factory Lead Time
27 Weeks
Lifecycle Status
ACTIVE (Last Updated: 6 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
36-BFSOP (0.295, 7.50mm Width) Exposed Pad
Number of Pins
36
Operating Temperature
-40°C~125°C TA
Packaging
Tape & Reel (TR)
Published
2012
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
36
ECCN Code
EAR99
Type
DC DC Regulator
Terminal Finish
Nickel/Gold/Palladium (Ni/Au/Pd)
Applications
Automotive
Subcategory
Display Drivers
Terminal Position
DUAL
Terminal Form
GULL WING
Terminal Pitch
0.5mm
Pin Count
36
Number of Outputs
2
Qualification Status
Not Qualified
Max Supply Voltage
40V
Topology
Step-Down (Buck), Step-Up (Boost)
Halogen Free
Halogen Free
Output Current per Channel
1.2A
Current - Output / Channel
1.2A
Internal Switch(s)
Yes
Screening Level
AEC-Q100
Dimming
PWM
Voltage - Supply (Min)
5V
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
- PCN Other :
- RohsStatement :
NCV78663DQ0R2G Overview
Using its 36-BFSOP (0.295, 7.50mm Width) Exposed Pad package, it is possible to save board space. 2 outputs are designed into LED drivers.As far as mounting is concerned, Surface Mount is adopted.There is no doubt that this is a very efficient and reliable DC DC Regulator.This LED driver can be operated at a temperature of -40°C~125°C TA. There are considerable benefits for Automotive.For its operation, terminations with a value of 0 are used.This configuration is built upon 36 pins.A voltage supply less than 5V could result in undetermined failures.It is mounted in the way of Surface Mount.A maximum supply voltage of 40V is acceptable.It consists of 36 pins.Moreover, it can be classified as Display Drivers due to its characteristics.
NCV78663DQ0R2G Features
Available in the 36-BFSOP (0.295, 7.50mm Width) Exposed Pad package
Operating temperature of -40°C~125°C TA
NCV78663DQ0R2G Applications
There are a lot of ON Semiconductor NCV78663DQ0R2G LED Driver ICs applications.
- Refrigeration lighting
- Industrial LED Lighting: Image Recognition Devices
- Power source for accessories such as car audios, car navigation systems, and ETC systems
- LED headlights
- Auxiliary lights for on-vehicle cameras
- A- lamps
- LED backlight driver for LCD displays for Tablets and Note PCs
- Linear fluorescent
- Architectural lighting
- Dimmable LED for vehicle interiors
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of OutputsBrand NameLead FreePart StatusPbfree CodeTerminal PitchView Compare
NCV78663DQ0R2G
ON Semiconductor36-BFSOP (0.295, 7.50mm Width) Exposed Pad
36
2
ON Semiconductor
Lead Free
Active
yes
0.5 mm
- LV52207NXB-VHON Semiconductor
24-LFSOP (0.173, 4.40mm Width)
24
2
ON Semiconductor
Lead Free
Active
yes
0.4 mm
NCV78663DQ0R2G
VS
LV52207NXB-VH
- NCV78763DQ0R2GON Semiconductor
SSOP
-
2
ON Semiconductor
Lead Free
Active
yes
0.5 mm
NCV78663DQ0R2G
VS
NCV78763DQ0R2G
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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How to pack electronic components in cartons?
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3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.