ON Semiconductor MC10EP08DR2G
MC10EP08DR2G
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ON Semiconductor MC10EP08DR2G information
Type
Parameter
Factory Lead Time
12 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
Published
2000
Series
10EP
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Terminal Finish
Tin (Sn)
Additional Feature
NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V
Subcategory
Gates
Packing Method
TAPE AND REEL
Technology
ECL
Voltage - Supply
3V~5.5V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Reflow Temperature-Max (s)
40
Base Part Number
10EP08
Pin Count
8
Number of Outputs
2
Output Type
Differential
Supply Voltage-Max (Vsup)
5.5V
Supply Voltage-Min (Vsup)
3V
Propagation Delay
300 ps
Quiescent Current
30mA
Family
10E
Logic Function
XNOR, XOR
Number of Inputs
2 Input (1, 1)
Halogen Free
Halogen Free
Logic Type
XOR/XNOR Gate
Number of Gates
1
Prop.
0.3 ns
High Level Output Current
-50mA
Low Level Output Current
50mA
Schmitt Trigger Input
No
Length
4.9mm
Width
3.9mm
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Environmental Information :
- PCN Packaging :
- RohsStatement :
MC10EP08DR2G Overview
A package in 8-SOIC (0.154, 3.90mm Width). In this package, we have included the Tape & Reel (TR) package as well. There is a version in Surface Mount available. Differential output is fully functional. It uses XOR/XNOR Gate logic communication type. It is possible to extend the operating temperature at -40°C~85°C. The inputs contain the 2 Input (1, 1) axis. There is a series of 10EP models based on this model. Powered by 3V~5.5V, it runs on batteries. The part includes terminations in the shape of a 8. If you would like to see more similar parts, search 10EP08. It has 8 pins jointed. Designed as a Surface Mount device, it is easy to install and remove. The 8 solution is designed for logic gate applications. The normal voltage needed for the part is 3.3V. A 10E product, it belongs to the 10E line of products. To be specific, this is a Gates for specialiGatesed needs. During quiescence, a current of 30mA exists across the device. Packaged in a proper TAPE AND REEL format. It is important that the maximum voltage on the device is kept below 5.5V in order to protect it. This device is dependent on 3V voltage or higher to operate. The compact package includes 1 gates. Devices employ 2 outputs. This part also includes NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V to improve performance.
MC10EP08DR2G Features
XOR/XNOR Gate logic device.
2 Input (1, 1) inputs.
1 gates.
2 outputs.
NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V.
MC10EP08DR2G Applications
There are a lot of ON Semiconductor MC10EP08DR2G Multi-Functional Gates & Inverters applications.
- Network projector front-ends
- Digital picture frame (DPF)
- Digital still cameras
- Cameras
- Pro audio mixers
- E-Meters
- Ethernet Switches
- General-purpose gating logic
- Consumer
- DLP front projection systems
- ImagePart NumberManufacturerPackage / CaseNumber of InputsNumber of PinsLogic FunctionPropagation DelayLow Level Output CurrentHigh Level Output CurrentSupply VoltageView Compare
MC10EP08DR2G
ON Semiconductor8-SOIC (0.154, 3.90mm Width)
2 Input (1, 1)
8
XNOR, XOR
300 ps
50 mA
-50 mA
3.3 V
- MC100EP08DGON Semiconductor
8-SOIC (0.154, 3.90mm Width)
2 Input (1, 1)
8
XNOR, XOR
300 ps
50 mA
-50 mA
3.3 V
MC10EP08DR2G
VS
MC100EP08DG
- MC100EP08DR2GON Semiconductor
8-SOIC (0.154, 3.90mm Width)
2 Input (1, 1)
8
XNOR, XOR
300 ps
50 mA
-50 mA
3.3 V
MC10EP08DR2G
VS
MC100EP08DR2G
- CD40107BMNA
8-SOIC (0.154, 3.90mm Width)
-
8
Buffer, NAND
100 ns
-
-
5 V
MC10EP08DR2G
VS
CD40107BM
- MC10EP05DR2ON Semiconductor
8-SOIC (0.154, 3.90mm Width)
2 Input (1, 1)
8
AND, NAND
270 ps
50 mA
-50 mA
3.3 V
MC10EP08DR2G
VS
MC10EP05DR2
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the ON Semiconductor's MC10EP08DR2G price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.