NXP USA Inc. N74F51D,602
N74F51D,602
NXP USA Inc. N74F51D,602 information
Type
Parameter
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Operating Temperature
0°C~70°C
Packaging
Tube
Published
1999
Series
74F
JESD-609 Code
e4
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
Terminal Finish
NICKEL PALLADIUM GOLD
Additional Feature
ASYMMETRICAL INPUTS
Subcategory
Gates
Technology
TTL
Voltage - Supply
4.5V~5.5V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
2
Supply Voltage
5V
Reflow Temperature-Max (s)
30
Base Part Number
74F51
Pin Count
14
JESD-30 Code
R-PDSO-G14
Output Type
Differential
Supply Voltage-Max (Vsup)
5.5V
Power Supplies
5V
Supply Voltage-Min (Vsup)
4.5V
Number of Circuits
2
Load Capacitance
50pF
Family
F/FAST
Number of Inputs
10 Input (3, 3, 2, 2)
Current - Output High, Low
1mA 20mA
Logic Type
AND/OR/INVERT Gate
Prop.
6.5 ns
Propagation Delay (tpd)
4.5 ns
Power Supply Current-Max (ICC)
7.5mA
Schmitt Trigger Input
No
Height Seated (Max)
1.75mm
Length
8.65mm
Width
3.9mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Obsolescence/ EOL :
N74F51D,602 Overview
This package contains 14-SOIC (0.154, 3.90mm Width). It is included in this package that the Tube package is also available. This item is available in Surface Mount as well. As far as Differential outputs are concerned, it has full functionality. It uses the AND/OR/INVERT Gate logic communication type. At 0°C~70°C, we have extended the operating temperature. A 10 Input (3, 3, 2, 2) input is included in it. This is a part of the 74F series of products. The power supply that powers the device is a 4.5V~5.5V power supply. Part includes 14 terminations. To find more parts that are similar, search 74F51. The pins are joined by 14 pins. It is normal to need 5V volts for this part. Circuits are built using 2 basic. The product is from the F/FAST category. To be specific, this is a Gates for specialiGatesed needs. Devices should have a maximum voltage under 5.5V. It is important for users to be aware that this device requires 4.5V or higher voltage in order to operate. ASYMMETRICAL INPUTS is also included in this part in order to improve performance. It generally requires 5V power supplies to operate.
N74F51D,602 Features
AND/OR/INVERT Gate logic device.
10 Input (3, 3, 2, 2) inputs.
ASYMMETRICAL INPUTS.
Uses 5V.
N74F51D,602 Applications
There are a lot of NXP USA Inc. N74F51D,602 Multi-Functional Gates & Inverters applications.
- Automotive
- Blu-ray players and home theaters
- DVR and DVS
- Audio docks: portable
- E-Meters
- Mobile internet devices
- Industrial
- Network projector front-ends
- Solid dtate drive (SSD): enterprise
- AV receivers
- ImagePart NumberManufacturerPackage / CaseNumber of InputsNumber of CircuitsSupply VoltageOperating TemperatureVoltage - SupplyTechnologyTerminal PositionView Compare
N74F51D,602
NXP USA Inc.14-SOIC (0.154, 3.90mm Width)
10 Input (3, 3, 2, 2)
2
5 V
0°C ~ 70°C
4.5V ~ 5.5V
TTL
DUAL
- N74F11D,623NXP USA Inc.
14-SOIC (0.154, 3.90mm Width)
3
3
5 V
0°C ~ 70°C
4.5V ~ 5.5V
TTL
DUAL
N74F51D,602
VS
N74F11D,623
- N74F51D,623NXP USA Inc.
14-SOIC (0.154, 3.90mm Width)
10 Input (3, 3, 2, 2)
2
5 V
0°C ~ 70°C
4.5V ~ 5.5V
TTL
DUAL
N74F51D,602
VS
N74F51D,623
- N74F86D,602NXP USA Inc.
14-SOIC (0.154, 3.90mm Width)
2
4
5 V
0°C ~ 70°C
4.5V ~ 5.5V
TTL
DUAL
N74F51D,602
VS
N74F86D,602
- N74F08D,623Nexperia USA Inc.
14-SOIC (0.154, 3.90mm Width)
2
-
5 V
0°C ~ 70°C
4.5V ~ 5.5V
TTL
DUAL
N74F51D,602
VS
N74F08D,623
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1. Understand the shipping rules of the destination country
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If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
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Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Freescale Semiconductor, Inc. (NXP Semiconductors)'s N74F51D,602 price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Freescale Semiconductor's current name is NXP Semiconductor. In terms of embedded processing solutions, Freescale Semiconductor is a global leader. We realize everything from microprocessors and microcontrollers to sensors, analog integrated circuits and connections. We firmly believe that technology is the foundation of innovation. Innovation can make our world greener, safer, healthier and more connected. Our key applications and end markets are numerous. There are not only automotive safety, hybrid and all-electric vehicles, next-generation wireless infrastructure, smart energy management, smart mobile devices, but also portable medical devices and consumer appliances.
