NXP USA Inc. MVF61NS151CMK50
MVF61NS151CMK50
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NXP USA Inc. MVF61NS151CMK50 information
Type
Parameter
Factory Lead Time
15 Weeks
Package / Case
364-LFBGA
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2002
Series
Vybrid, VF6xx
JESD-609 Code
e2
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
364
ECCN Code
5A002.A.1
Terminal Finish
Tin/Silver (Sn/Ag)
HTS Code
8542.31.00.01
Subcategory
Microcontrollers
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.23V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
40
Base Part Number
MVF61NS151
JESD-30 Code
S-PBGA-B364
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
1.26V
Power Supplies
3.3V
Supply Voltage-Min (Vsup)
1.16V
Number of I/O
131
Speed
500MHz, 167MHz
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
Core Processor
ARM® Cortex®-A5 + Cortex®-M4
Supply Current-Max
850mA
Bit Size
16
Has ADC
YES
DMA Channels
YES
PWM Channels
NO
DAC Channels
YES
Address Bus Width
16
ROM (words)
0
External Data Bus Width
16
Voltage - I/O
3.3V
Ethernet
10/100Mbps (2)
Number of Cores/Bus Width
2 Core 32-Bit
Graphics Acceleration
Yes
RAM Controllers
LPDDR2, DDR3, DRAM
USB
USB 2.0 OTG + PHY (1)
Additional Interfaces
CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Co-Processors/DSP
Multimedia; NEON™ MPE
ROM Programmability
FLASH
Security Features
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Display & Interface Controllers
DCU, GPU, LCD, VideoADC, VIU
Length
17mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- PCN Part Status Change :
- PCN Packaging :
- PCN Assembly/Origin :
- PCN Design/Specification :
- Environmental Information :
MVF61NS151CMK50 Description
The MVF61NS151CMK50 is a heterogeneous dual-core solution that combines the Arm? Cortex?-A5 and Cortex-M4 cores. The MVF61NS151CMK50 includes Dual USB 2.0 OTG controllers with integrated PHY Dual 10/100 Ethernet controllers with L2 switch, multiple serial interfaces, such as UARTs with support for ISO 7816 SIM/smart cards, SPI and I2C and dual CAN module, and up to 1.5 MB of on-chip SRAM and a rich suite of communication, connectivity and human-machine interfaces (HMI).
MVF61NS151CMK50 Features
Dual heterogeneous core: Cortex-A5 and Cortex-M4
Optional 512 KB L2 Cache
1.5 MB on-chip SRAM (1.0 MB when L2 Cache is selected)
Dual USB 2.0 OTG with integrated PHY
Dual Ethernet 10/100 MAC with L2 switch
Both digital and analog video camera interfaces
MVF61NS151CMK50 Applications
Heating Ventilation, and Air Conditioning (HVAC)
3-Phase AC Induction Motor
Air Conditioning (AC)
Anesthesia Unit Monitor
Hearables
Input Device (Mouse, Pen, Keyboard)
- ImagePart NumberManufacturerPackage / CaseSupply VoltageNumber of I/OEthernetTerminal PitchSupply Voltage-Max (Vsup)ROM (words)PackagingView Compare
MVF61NS151CMK50
NXP USA Inc.364-LFBGA
1.23 V
131
10/100Mbps (2)
0.8 mm
1.26 V
0
Tray
- MVF50NN151CMK50NXP USA Inc.
364-LFBGA
1.23 V
131
10/100Mbps (2)
0.8 mm
1.26 V
0
Tray
MVF61NS151CMK50
VS
MVF50NN151CMK50
- MVF60NN151CMK50NXP USA Inc.
364-LFBGA
1.23 V
131
10/100Mbps (2)
0.8 mm
1.26 V
0
Tray
MVF61NS151CMK50
VS
MVF60NN151CMK50
- MVF50NS151CMK50NXP USA Inc.
364-LFBGA
1.23 V
131
10/100Mbps (2)
0.8 mm
1.26 V
0
Tray
MVF61NS151CMK50
VS
MVF50NS151CMK50
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Freescale Semiconductor, Inc. (NXP Semiconductors)'s MVF61NS151CMK50 price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Freescale Semiconductor's current name is NXP Semiconductor. In terms of embedded processing solutions, Freescale Semiconductor is a global leader. We realize everything from microprocessors and microcontrollers to sensors, analog integrated circuits and connections. We firmly believe that technology is the foundation of innovation. Innovation can make our world greener, safer, healthier and more connected. Our key applications and end markets are numerous. There are not only automotive safety, hybrid and all-electric vehicles, next-generation wireless infrastructure, smart energy management, smart mobile devices, but also portable medical devices and consumer appliances.
