NXP USA Inc. MCIMX251AJM4A
MCIMX251AJM4A
In Stock:94131
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NXP USA Inc. MCIMX251AJM4A information
Type
Parameter
Factory Lead Time
15 Weeks
Package / Case
400-LFBGA
Surface Mount
YES
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
2005
Series
i.MX25
JESD-609 Code
e1
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
400
ECCN Code
5A992
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.31.00.01
Subcategory
Microprocessors
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.45V
Terminal Pitch
0.8mm
Reflow Temperature-Max (s)
40
Base Part Number
MCIMX251
JESD-30 Code
S-PBGA-B400
Supply Voltage-Max (Vsup)
1.52V
Power Supplies
1.2/1.51.8/3.3V
Supply Voltage-Min (Vsup)
1.38V
Speed
400MHz
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
Core Processor
ARM926EJ-S
Clock Frequency
24MHz
Bit Size
32
Address Bus Width
26
Boundary Scan
YES
Low Power Mode
YES
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
YES
Voltage - I/O
2.0V 2.5V 2.7V 3.0V 3.3V
Ethernet
10/100Mbps (1)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
LPDDR, DDR, DDR2
USB
USB 2.0 + PHY (2)
Additional Interfaces
CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Security Features
Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Display & Interface Controllers
Keypad
Height Seated (Max)
1.6mm
Length
17mm
RoHS Status
ROHS3 Compliant
- Datasheets :
- Environmental Information :
- PCN Assembly/Origin :
- PCN Packaging :
MCIMX251AJM4A Overview
The embedded microprocessor ships overseas conveniently packed in 400-LFBGA. High reliability is achieved using advanced packaging method Tray. 1 Core 32-Bit cores/Bus width are present in the CPU. Be aware of the operating temperature around -40°C~85°C TA. The i.MX25 series contains it. Core-wise, this CPU has a ARM926EJ-S processor. It has LPDDR, DDR, DDR2 RAM controllers. The microprocessor features interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART for better service. At 2.0V 2.5V 2.7V 3.0V 3.3V, the CPU runs its I/O. I would rate this as a MICROPROCESSOR for the uPs/uCs/Peripheral ICs type. MCIMX251 is a good way to search for variants of the microprocessor. Total terminations are 400. In the case of a 1.45V voltage supply, the embedded microprocessor should be turned on and run. This microprocessor has an architecture of 32 bits. It can supply a maximum current of 1.52V. A typical Microprocessors embedded microprocessor. 16 is the width of the external data bus on this CPU. There is a clock frequency of 24MHz on the microprocessor. According to its datasheet, this micro processor requires 1.2/1.51.8/3.3V power supplies.
MCIMX251AJM4A Features
ARM926EJ-S Core
32-Bit Structure
MCIMX251AJM4A Applications
There are a lot of NXP USA Inc. MCIMX251AJM4A Microprocessor applications.
- Sonography (Ultrasound imaging)
- Home appliances
- Glucose monitoring systems (for Type 1 Diabetes)
- Metering & measurement field
- Refrigerators
- Data acquisition and control
- Dryers
- Day to day life field
- Nintendo
- Copiers
- ImagePart NumberManufacturerPackage / CaseSupply VoltageExternal Data Bus WidthFactory Lead TimeTerminal PitchSupply Voltage-Min (Vsup)Supply Voltage-Max (Vsup)PublishedView Compare
MCIMX251AJM4A
NXP USA Inc.400-LFBGA
1.45 V
16
15 Weeks
0.8 mm
1.38 V
1.52 V
2005
- MCIMX253CJM4ANXP USA Inc.
400-LFBGA
1.45 V
16
15 Weeks
0.8 mm
1.38 V
1.52 V
2005
MCIMX251AJM4A
VS
MCIMX253CJM4A
- MCIMX253DJM4ANXP USA Inc.
400-LFBGA
1.45 V
16
15 Weeks
0.8 mm
1.38 V
1.52 V
2005
MCIMX251AJM4A
VS
MCIMX253DJM4A
- MCIMX257DJM4ANXP USA Inc.
400-LFBGA
1.45 V
16
15 Weeks
0.8 mm
1.38 V
1.52 V
2005
MCIMX251AJM4A
VS
MCIMX257DJM4A
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Freescale Semiconductor, Inc. (NXP Semiconductors)'s MCIMX251AJM4A price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Freescale Semiconductor's current name is NXP Semiconductor. In terms of embedded processing solutions, Freescale Semiconductor is a global leader. We realize everything from microprocessors and microcontrollers to sensors, analog integrated circuits and connections. We firmly believe that technology is the foundation of innovation. Innovation can make our world greener, safer, healthier and more connected. Our key applications and end markets are numerous. There are not only automotive safety, hybrid and all-electric vehicles, next-generation wireless infrastructure, smart energy management, smart mobile devices, but also portable medical devices and consumer appliances.
