Exploring the Influence of Low Temperatures on Electronic Components

With the advancement of science and technology and the expansion of the application area, the quality and reliability of electronic components are more and more highly valued. However, low temperature failure can seriously affect product stability and life. Low temperature refers to the state where the temperature of an object is below 0℃. In such environment, the physical, chemical and electrical properties of electronic components will change, so in which aspects they performed？

1. Changes in Electrical Capability
Low temperature will reduce the electrical capability of electronic components, especially for integrated circuits, diodes and MOSFETs and other components. Because of the low temperature, the electron and Lattice lattice interaction increases, the electron moves slower in the medium, the activation energy required to become larger, all of which will lead to a reduction in the conductive ability of the device.

2. Insulation Deterioration

Under the low temperature environment, the insulation ability of electronic components deteriorates, mainly due to the decrease in the polarization rate of the medium and the polarization rate of the bipolar molecules, which is an important influence on the insulation strength. Besides, the lattice vibration of the material decreases in the low temperature environment, which leads to the decrease of the oxide dielectric constant, thus also affecting the insulation ability of the device.

3. Thermal Stability Deterioration
At low temperature, the thermal stability of the material is significantly reduced, especially the poor thermal stability of the material, it is easier to decompose and fail in the low temperature environment. The speed of chemical reaction also slows down with the lowering of temperature, which leads to the slowing down of the reaction speed of some components at low temperature, thus affecting their normal work.

4. Mechanical Properties Deterioration
The strength and toughness of the material are reduced under the low temperature environment, mainly due to changes in the lattice structure of the material after cooling, the smaller size of the grain and the reduction of the activity of the grain boundary also affects the mechanical properties of the material. In addition, the low-temperature environment will also cause material contraction and vibration, resulting in deformation, loosening, or even rupture of the machine parts.

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