Texas Instruments TMS320DM642AZDK7
TMS320DM642AZDK7
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Texas Instruments TMS320DM642AZDK7 information
Type
Parameter
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
548-FBGA, FCBGA
Number of Pins
548
Weight
2.44611g
Operating Temperature
0°C~90°C TC
Packaging
Tray
Series
TMS320DM64x, DaVinci™
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Not For New Designs
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
548
ECCN Code
3A991.A.2
Type
Fixed Point
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
HTS Code
8542.31.00.01
Subcategory
Digital Signal Processors
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.4V
Terminal Pitch
0.8mm
Frequency
720MHz
Base Part Number
320DM642
Pin Count
548
Operating Supply Voltage
1.4V
Power Supplies
1.43.3V
Interface
Host Interface, I2C, McASP, McBSP, PCI
Max Supply Voltage
3.46V
Min Supply Voltage
1.36V
Number of I/O
16
Memory Type
SDRAM, SRAM
Number of Bits
64
Bit Size
32
Data Bus Width
32b
Core Architecture
TMS320
Boundary Scan
YES
Low Power Mode
YES
Integrated Cache
YES
Voltage - I/O
3.30V
Number of Timers
3
Number of External Interrupts
4
Barrel Shifter
NO
Internal Bus Architecture
MULTIPLE
Non-Volatile Memory
External
Voltage - Core
1.40V
On Chip Data RAM
160kB
Number of DMA Channels
64
Height
2.5mm
Length
23mm
Width
23mm
Thickness
1.8mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
- Datasheets :
TMS320DM642AZDK7 Overview
It is a type of electronic component available in package 548-FBGA, FCBGA.There is a packaging method of Tray provided with it.As a member of Fixed Point, it is ideally suitable for a wide range of applications.The mounting of the device is done in the direction of Surface Mount.It is recommended that the device operate at a temperature of 0°C~90°C TC to ensure its normal operation.In analog circuits, the analog voltage range 3.30V represents the voltage range that is available for input or output.It is a part of the TMS320DM64x, DaVinci? series of digital signal processors.The terminations for its uses are 548.A voltage of 1.4V is used as the supply voltage.Pins are located on the 548 component.Its configuration includes 548 pins.The base part number 320DM642 allows identification of a wide range of related parts.The device is specifically designed to operate at the frequency of 720MHz.A Surface Mount mounting method is used for its mounting.This device falls into the subcategory of Digital Signal Processors based on its specific characteristics.This device can be powered by voltages as low as 1.36V.A maximum voltage of 3.46V can be provided to this device.A supply voltage of 1.4V is required for its operation.1.43.3V electric power supplies it.This electronic part can also provide additional features to ALSO REQUIRES 3.3V SUPPLY.A TMS320-architecture processor core is used here.The device is equipped with 16 I/Os.Memory type SDRAM, SRAM is used by it.3 timers are used in industrial environments to provide accurate feedback and event activation.An external source is causing 4 interrupts.The device stores 64 pieces of information.For data transfer, 64 DMA channels are available without overloading the CPU.
TMS320DM642AZDK7 Features
Supplied in the 548-FBGA, FCBGA package
Operating supply voltage of 1.4V
16 I/Os
4 external interrupts
TMS320DM642AZDK7 Applications
There are a lot of Texas Instruments TMS320DM642AZDK7 DSP applications.
- Encoding/broadcast
- Digital camera
- Remote sensing image processing technology
- Audio
- Digital image processing
- Speech processing
- Dam design
- Computers and laptop
- Image signal processing
- Machinery and equipment
- ImagePart NumberManufacturerPackage / CaseNumber of PinsData Bus WidthInterfaceMemory TypeMin Supply VoltageSupply VoltageMax Supply VoltageView Compare
TMS320DM642AZDK7
NA548-FBGA, FCBGA
548
32 b
Host Interface, I2C, McASP, McBSP, PCI
SDRAM, SRAM
1.36 V
1.4 V
3.46 V
TMS32C6415EGLZ5E0NA532-BFBGA, FCBGA
532
32 b
Host Interface, McBSP, PCI, UTOPIA
SDRAM, SRAM
1.14 V
1.2 V
3.46 V
TMS320DM642AZDK7
VS
TMS32C6415EGLZ5E0
TMS320DM8148CCYE2NA684-BFBGA, FCBGA
684
32 b
CAN, Ethernet, I2C, McASP, McBSP, MMC/SD/SDIO, SATA, SPI, UART, USB
Cache, ROM, SRAM
1.05 V
1.35 V
3.47 V
TMS320DM642AZDK7
VS
TMS320DM8148CCYE2
- TMS32C6415EZLZ6E3NA
532-BFBGA, FCBGA
532
32 b
Host Interface, McBSP, PCI, UTOPIA
SDRAM, SRAM
1.36 V
1.4 V
3.46 V
TMS320DM642AZDK7
VS
TMS32C6415EZLZ6E3
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1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s TMS320DM642AZDK7 price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
