Texas Instruments TLC555IDR
TLC555IDR
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Texas Instruments TLC555IDR information
Type
Parameter
Factory Lead Time
8 Weeks
Lifecycle Status
ACTIVE (Last Updated: 5 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Weight
72.603129mg
Operating Temperature
-40°C~85°C
Packaging
Cut Tape (CT)
Series
LinCMOS™
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Type
555 Type, Timer/Oscillator (Single)
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Analog Waveform Generation Functions
Max Power Dissipation
725mW
Voltage - Supply
3V~15V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3V
Current Rating
250A
Frequency
2.1MHz
Base Part Number
TLC555
Pin Count
8
Power Supplies
5V
Supply Voltage-Min (Vsup)
2V
Operating Supply Current
360μA
Power Dissipation
725mW
Quiescent Current
250μA
Number of Timers/Counters
1
Supply Current-Max (Isup)
0.5mA
High Level Output Current
-10mA
Low Level Output Current
100mA
Ambient Temperature Range High
85°C
Height
1.75mm
Length
4.9mm
Width
3.91mm
Thickness
1.58mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
TLC555IDR Description
The TLC555IDR is a monolithic timing circuit fabricated using the TI LinCMOS™ process.
TLC555IDR Features
Very low power consumption:
– 1-mW typical at VDD = 5 V
Capable of operation in astable mode
CMOS output capable of swinging rail to rail
High output current capability
– Sink: 100-mA typical
– Source: 10-mA typical
Output fully compatible with CMOS, TTL, and MOS
Low supply current reduces spikes during output transitions
Single-supply operation from 2 V to 15 V
Functionally interchangeable with the NE555; has the same pinout
ESD protection exceeds 2000 V per MIL-STD883C, method 3015.2
Available in Q-temp automotive
– High-reliability automotive applications
– Configuration control and print support
– Qualification to automotive standards
TLC555IDR Applications
Precision timing
Pulse generation
Sequential timing
Time delay generation
Pulse width modulation
Pulse position modulation
Linear ramp generator
- ImagePart NumberManufacturerPackage / CaseNumber of PinsQuiescent CurrentLow Level Output CurrentFrequencySupply VoltageNumber of TerminationsMoisture Sensitivity Level (MSL)View Compare
TLC555IDR
NA8-SOIC (0.154, 3.90mm Width)
8
250 μA
100 mA
2.1MHz
3 V
8
1 (Unlimited)
- TLC555CDNA
8-SOIC (0.154, 3.90mm Width)
8
250 μA
100 mA
2.1MHz
5 V
8
1 (Unlimited)
TLC555IDR
VS
TLC555CD
NCV1455BDR2GON Semiconductor8-SOIC (0.154, 3.90mm Width)
8
-
200 mA
2 MHz
5 V
8
1 (Unlimited)
TLC555IDR
VS
NCV1455BDR2G
- TLC555CDRNA
8-SOIC (0.154, 3.90mm Width)
8
250 μA
100 mA
2.1MHz
5 V
8
1 (Unlimited)
TLC555IDR
VS
TLC555CDR
- TLC555CDRG4NA
8-SOIC (0.154, 3.90mm Width)
8
250 μA
100 mA
2.1MHz
5 V
8
1 (Unlimited)
TLC555IDR
VS
TLC555CDRG4
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s TLC555IDR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
