Texas Instruments THS7353PW
THS7353PW
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Texas Instruments THS7353PW information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 week ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
20-TSSOP (0.173, 4.40mm Width)
Number of Pins
20
Weight
78.187985mg
Packaging
Tube
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
20
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Applications
2:1 Multiplexer-Amplifier
Subcategory
Buffer Amplifier
Max Power Dissipation
1.2W
Technology
CMOS
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
3
Supply Voltage
3.3V
Terminal Pitch
0.65mm
Base Part Number
THS7353
Pin Count
20
Output Type
Rail-to-Rail
Temperature Grade
INDUSTRIAL
Number of Circuits
3
Operating Supply Current
18.8mA
Nominal Supply Current
16.2mA
Output Current
85mA
Quiescent Current
6mA
Slew Rate
300V/μs
Amplifier Type
BUFFER
Voltage - Supply, Single/Dual (±)
2.7V~5.5V
Output Current per Channel
85mA
Supply Type
Single
Bandwidth
41MHz
Gain Bandwidth Product
190MHz
Voltage Gain
14dB
Average Bias Current-Max (IIB)
5μA
Supply Voltage Limit-Max
5.5V
-3db Bandwidth
150MHz
Height
1.2mm
Length
6.5mm
Width
4.4mm
Thickness
1mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
THS7353PW Overview
There is a Tube package attached to class d amplifier.20-TSSOP (0.173, 4.40mm Width) package reduces space by making class d amp available.It is an excellent choice for 2:1 Multiplexer-Amplifier due to audio amplifiers high performance.A Surface Mount mounting method is used to connect audio power amplifier to the PCB.A number of 3 circuits are utilized to enhance the audio ic's flexibility of the system.Audio amp can be located using its base part number THS7353.On audio digital amplifier, there is a pin count of 20.20 terminations make up digital amplifiers structure.Its -3db bandwidth is 150MHz.As audio power amplifier of Buffer Amplifier, this audio power amplifier is included.Audio amplifier operates on a supply current of 18.8mA.The board is constructed wamplifier ich 20 pins.A temperature of less than 85°C should be used for operation.It is recommended that the operating temperature is at least -40°C.In order to achieve high efficiency, the supply voltage is set to 3.3V.Mounting is done with Surface Mount.There is a type of amplifier BUFFER on the audio amplifier.The output current is set to 85mA in this scenario.As far as its supply type is concerned, it is Single.The audio amplifier ic gains a voltage of 14dB.In addition, it consumes 6mA quiescent current and is not affected by external factors.
THS7353PW Features
Buffer Amplifier subcategory
20 pins
THS7353PW Applications
There are a lot of Texas Instruments THS7353PW Video Amps and Modules applications.
- HiFi Audio System Equipment
- Telematics control unit
- Set-Top Box
- Analog and Digital Mixing Consoles
- General-Purpose Amplifier Applications
- Automotive active noise cancellation
- Emergency call (eCall)
- Microphone Preamplifier Circuit
- Automotive head unit
- Automotive
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CircuitsSlew RateGain Bandwidth ProductSupply VoltageOperating Supply CurrentRadiation HardeningView Compare
THS7353PW
NA20-TSSOP (0.173, 4.40mm Width)
20
3
300V/μs
190 MHz
3.3 V
18.8 mA
No
- THS7303PWNA
20-TSSOP (0.173, 4.40mm Width)
20
-
320V/μs
190 MHz
-
18.9 mA
No
THS7353PW
VS
THS7303PW
OPA3355EA/2K5NA14-TSSOP (0.173, 4.40mm Width)
14
-
360V/μs
200 MHz
5 V
8.3 mA
No
THS7353PW
VS
OPA3355EA/2K5
- THS7303PWRNA
20-TSSOP (0.173, 4.40mm Width)
20
3
320V/μs
-
-
18.9 mA
No
THS7353PW
VS
THS7303PWR
MAX4028EUE+TMaxim Integrated16-TSSOP (0.173, 4.40mm Width)
16
3
300V/μs
-
5 V
29 mA
No
THS7353PW
VS
MAX4028EUE+T
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How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s THS7353PW price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
