Texas Instruments SN74ALVCF162835GR
SN74ALVCF162835GR
In Stock:94131
Qty
Unit Price
Ext Price
1
$9.550000
$9.550000
10
$9.012000
$90.120000
100
$8.502000
$850.200000
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Inquire for More Quantity
Add to RFQ list
Texas Instruments SN74ALVCF162835GR information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 5 days ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
56-TFSOP (0.240, 6.10mm Width)
Number of Pins
56
Weight
249.986095mg
Operating Temperature
-40°C~85°C
Packaging
Cut Tape (CT)
Series
74ALVCF
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
56
ECCN Code
EAR99
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Subcategory
Bus Driver/Transceivers
Packing Method
TR
Technology
CMOS
Voltage - Supply
2.3V~3.6V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
2.5V
Terminal Pitch
0.5mm
Base Part Number
74ALVCF162835
Pin Count
56
Number of Elements
1
Polarity
Non-Inverting
Supply Voltage-Max (Vsup)
3.6V
Power Supplies
3.3V
Supply Voltage-Min (Vsup)
2.3V
Number of Channels
18
Number of Circuits
18-Bit
Operating Supply Current
100nA
Load Capacitance
50pF
Number of Ports
2
Output Current
18mA
Max Supply Current
40μA
Number of Bits
18
Propagation Delay
5.6 ns
Quiescent Current
100nA
Turn On Delay Time
6 ns
Family
ALVC/VCX/A
Direction
Unidirectional
Output Characteristics
3-STATE
Current - Output High, Low
18mA 18mA
Logic Type
Universal Bus Driver
Prop.
3.5 ns
Control Type
ENABLE LOW
Power Supply Current-Max (ICC)
0.04mA
Translation
N/A
Height
1.2mm
Length
14mm
Width
6.1mm
Thickness
1.15mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
SN74ALVCF162835GR Overview
As part of the 56-TFSOP (0.240, 6.10mm Width) package, it is embedded. Cut Tape (CT) is the way it is packaged. In order to achieve this superior flexibility, 18-Bit circuits are used. There is a logic type Universal Bus Driver associated with this electrical device. Surface Mount is pointing towards the electronic part. The operating temperature should be higher than -40°C~85°C in order for the machine to function properly. Due to its high and low output current options, 18mA 18mA's maximum level of flexibility is achieved when it comes to designing its features. FPGAs in the 74ALVCF series are this type. With a voltage supply of 2.3V~3.6V, it is able to operate. The 74ALVCF162835 family is comprised of it. In 56 terminations, a transmission line is terminated with an impedance-matched device. For normal operation, the supply voltage must be kept above 2.5V in order for the device to function properly. 56 pins are included. An electronic part designed with 18 Bits is used in this product. An example of this is through the use of 2 terminations, where a particular device is used to end a transmission line with an impedance matching device, fitted with its characteristic impedance. As you can see from the image, this electronic component is mounted in a Surface Mount-direction. 56 pins are used in its design. In the family of ALVC/VCX/A devices, this electronic device belongs. Upon reaching 3.6V, the maximum supply voltage (Vsup) is reached. In general, Vsup should be higher than 2.3V. Powered by 3.3V power supplies, it runs on a battery. An element of this system consists of 1 components. Because of its reliable performance, this device is an excellent choice for TR. A maximum amount of design flexibility can be achieved with 18mA due to its output current. Bus Driver/Transceivers contains this part. It is evident that the number of channels is growing strong/weak: 18. External factors do not affect the amount of quiescent current consumed by it. During operation, its maximal current reaches 40μA.
SN74ALVCF162835GR Features
56-TFSOP (0.240, 6.10mm Width) package
74ALVCF series
74ALVCF162835 family
56 pin count
56 pins
3.3V power supplies
1 elements
SN74ALVCF162835GR Applications
There are a lot of Texas Instruments SN74ALVCF162835GR Universal Bus Functions applications.
- Disk read-write IC
- Instrumentation Systems
- Small and medium off-grid systems
- Digital watch
- Digital system
- measuring instrument
- Projector
- Push-button lock
- Electricity for military and civilian life in areas without electricity
- Microcontrollers
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSupply VoltageTerminal PitchSupply Voltage-Max (Vsup)Moisture Sensitivity Level (MSL)Power SuppliesFamilyView Compare
SN74ALVCF162835GR
NA56-TFSOP (0.240, 6.10mm Width)
56
2.5 V
0.5 mm
3.6 V
1 (Unlimited)
3.3 V
ALVC/VCX/A
- SN74ALVCH162268GRNA
56-TFSOP (0.240, 6.10mm Width)
56
1.8 V
0.5 mm
3.6 V
1 (Unlimited)
3.3 V
ALVC/VCX/A
SN74ALVCF162835GR
VS
SN74ALVCH162268GR
- SN74ALVCH16270DGGRNA
56-TFSOP (0.240, 6.10mm Width)
56
1.8 V
0.5 mm
3.6 V
1 (Unlimited)
3.3 V
ALVC/VCX/A
SN74ALVCF162835GR
VS
SN74ALVCH16270DGGR
- SN74ALVCH16409DGGRNA
56-TFSOP (0.240, 6.10mm Width)
56
1.8 V
0.5 mm
3.6 V
1 (Unlimited)
3.3 V
ALVC/VCX/A
SN74ALVCF162835GR
VS
SN74ALVCH16409DGGR
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s SN74ALVCF162835GR price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
