Texas Instruments CD74HC73M
CD74HC73M
In Stock:94131
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Unit Price
Ext Price
1
$10.890000
$10.890000
10
$10.269000
$102.690000
100
$9.688100
$968.810000
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Texas Instruments CD74HC73M information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 4 days ago)
Contact Plating
Gold
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
14-SOIC (0.154, 3.90mm Width)
Number of Pins
14
Weight
129.387224mg
Operating Temperature
-55°C~125°C TA
Packaging
Tube
Series
74HC
JESD-609 Code
e4
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
14
ECCN Code
EAR99
Type
JK Type
Additional Feature
MASTER SLAVE OPERATION
Subcategory
FF/Latch
Technology
CMOS
Voltage - Supply
2V~6V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
4.5V
Base Part Number
74HC73
Function
Reset
Output Type
Differential
Polarity
Non-Inverting
Supply Voltage-Max (Vsup)
6V
Supply Voltage-Min (Vsup)
2V
Number of Channels
2
Load Capacitance
50pF
Output Current
5.2mA
Clock Frequency
60MHz
Propagation Delay
160 ns
Quiescent Current
4μA
Turn On Delay Time
13 ns
Family
HC/UH
Logic Function
Flip-Flop, JK-Type
Current - Output High, Low
5.2mA 5.2mA
Max I(ol)
0.006 A
Number of Bits per Element
1
Max Propagation Delay @ V, Max CL
28ns @ 6V, 50pF
Prop.
40 ns
Trigger Type
Negative Edge
Input Capacitance
10pF
Schmitt Trigger
No
Power Supply Current-Max (ICC)
0.04mA
Clock Edge Trigger Type
Negative Edge
Height
1.75mm
Length
8.65mm
Width
3.91mm
Thickness
1.58mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Packaging :
CD74HC73M Overview
The item is packaged in 14-SOIC (0.154, 3.90mm Width)cases. D flip flop is embedded in the Tube package. Differentialis the output configured for it. There is a trigger configured with Negative Edge. There is an electric part mounted in the way of Surface Mount. A voltage of 2V~6Vis required for its operation. The operating temperature is -55°C~125°C TA. Logic flip flops of this type are classified as JK Type. JK flip flop belongs to the 74HCseries of FPGAs. There should be no greater frequency than 60MHzon its output. In 14terminations, a transmission line is terminated with a JK flip flop that matches its characteristic impedance. You can search similar parts based on 74HC73. A voltage of 4.5V is used as the power supply for this D latch. This JK flip flop has a 10pFfarad input capacitance. A device of this type belongs to the family of HC/UH. A part of the electronic system is mounted in the way of Surface Mount. Basically, it is designed with a set of 14 pins. It has a clock edge trigger type of Negative Edge. The part is included in FF/Latch. The maximal supply voltage (Vsup) reaches 6V. For normal operation, the supply voltage (Vsup) should be above 2V. This T flip flop features a maximum design flexibility due to its output current of 5.2mA. There is a consumption of 4μAof quiescent current from it. In addition, you can refer to the additinal MASTER SLAVE OPERATION of the D latch. 2 channels are available.
CD74HC73M Features
Tube package
74HC series
14 pins
CD74HC73M Applications
There are a lot of Texas Instruments CD74HC73M Flip Flops applications.
- Bounce elimination switch
- Balanced 24 mA output drivers
- Divide a clock signal by 2 or 4
- Instrumentation
- Counters
- Synchronous counter
- ESD performance
- Data transfer
- ESCC
- Memory
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionNumber of Bits per ElementPropagation DelayClock Edge Trigger TypeSupply VoltageQuiescent CurrentView Compare
CD74HC73M
NA14-SOIC (0.154, 3.90mm Width)
14
Flip-Flop, JK-Type
1
160 ns
Negative Edge
4.5 V
4 μA
MC74HC74ADR2GON Semiconductor14-SOIC (0.154, 3.90mm Width)
14
AND, D-Type, Flip-Flop
1
160 ns
Positive Edge
3 V
2 μA
CD74HC73M
VS
MC74HC74ADR2G
- CD74HC107M96NA
14-SOIC (0.154, 3.90mm Width)
14
Flip-Flop, JK-Type
1
170 ns
Negative Edge
4.5 V
4 μA
CD74HC73M
VS
CD74HC107M96
- SN74HC74DRNA
14-SOIC (0.154, 3.90mm Width)
14
AND, D-Type, Flip-Flop
1
175 ns
Positive Edge
5 V
4 μA
CD74HC73M
VS
SN74HC74DR
SN74HC112DNA16-SOIC (0.154, 3.90mm Width)
16
AND, Flip-Flop, JK-Type
1
125 ns
Negative Edge
5 V
4 μA
CD74HC73M
VS
SN74HC112D
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We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
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From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT, SF Express.
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The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Texas Instruments Incorporated (TI)'s CD74HC73M price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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- How to transport your electronic components safely?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history：
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.
