Microchip Technology MT8870DS1
MT8870DS1
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Microchip Technology MT8870DS1 information
Type
Parameter
Factory Lead Time
8 Weeks
Lifecycle Status
IN PRODUCTION (Last Updated: 1 month ago)
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
18-SOIC (0.295, 7.50mm Width)
Number of Pins
18
Operating Temperature
-40°C~85°C
Packaging
Tube
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
18
Terminal Finish
MATTE TIN
Subcategory
Telecom Signaling Circuits
Max Power Dissipation
500mW
Technology
CMOS
Voltage - Supply
4.75V~5.25V
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Supply Voltage
5V
Frequency
3.58MHz
Reflow Temperature-Max (s)
30
Function
DTMF Receiver
Operating Supply Voltage
5V
Power Supplies
5V
Number of Circuits
1
Operating Supply Current
3mA
Nominal Supply Current
3mA
Logic Function
Receiver
Telecom IC Type
DTMF SIGNALING CIRCUIT
Height Seated (Max)
2.65mm
Width
7.5mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
- PCN Other :
MT8870DS1 Overview
Space is saved on the board by using the 18-SOIC (0.295, 7.50mm Width) package.To pack telecommunications equipment, the way of Tube is used.A Surface Mount-mount is used for mounting the telecom circuit.1 circuits are used in this telecom IC .When the voltage for 4.75V~5.25V is provided, improved efficiency can be achieved.Using -40°C~85°C as the operating temperature can result in reliable performance.In Surface Mount's direction, telecom switching is mounted.Telecom switching configuration has 18 terminations.5V is its supply voltage.The telecom interface has 18 pins.Telecom ICs of type DTMF SIGNALING CIRCUIT are used in it.In order to provide designers with a great deal of flexibility, this telecom circuit operates on the supply voltage of 5V.Designers benefit from great flexibility since it works with the 3mA supply current.Telecommunications device belongs to the subcategory of Telecom Signaling Circuits.At frequency 3.58MHz, this telecommunication product operates.
MT8870DS1 Features
Available in the 18-SOIC (0.295, 7.50mm Width) package
DTMF SIGNALING CIRCUIT as telecom IC type
Operating supply voltage of 5V
Operating supply current of 3mA
Operating with the requency of 3.58MHz
MT8870DS1 Applications
There are a lot of Microchip Technology MT8870DS1 Telecom applications.
- E1 Network Equipment
- ISDN NT1/TA
- T1/E1/J1 Multiplexer and Channel Banks
- LAN Routers
- Home Side Box
- Interfaces to SONET STS-1 Networks
- Digital cross connects (DSX-1)
- Multi-Line E1 Interface Cards
- E1 Rates PCM Line Interface
- Wireless Local Loop
- ImagePart NumberManufacturerPackage / CaseNumber of PinsLogic FunctionSupply VoltageRoHS StatusMountPeak Reflow Temperature (Cel)Terminal PositionView Compare
MT8870DS1
Microchip Technology18-SOIC (0.295, 7.50mm Width)
18
Receiver
5 V
ROHS3 Compliant
Surface Mount
260
DUAL
SN75107BDNA14-SOIC (0.154, 3.90mm Width)
14
-
5 V
ROHS3 Compliant
Surface Mount
260
DUAL
MT8870DS1
VS
SN75107BD
MAX491CSD+Maxim Integrated14-SOIC (0.154, 3.90mm Width)
14
Receiver, Transceiver
5 V
ROHS3 Compliant
Surface Mount
260
DUAL
MT8870DS1
VS
MAX491CSD+
DS3486MX/NOPBNA16-SOIC (0.154, 3.90mm Width)
16
-
5 V
ROHS3 Compliant
Surface Mount
260
DUAL
MT8870DS1
VS
DS3486MX/NOPB
- DS3486M/NOPBNA
16-SOIC (0.154, 3.90mm Width)
16
-
5 V
ROHS3 Compliant
Surface Mount
260
DUAL
MT8870DS1
VS
DS3486M/NOPB
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2.Are the Microchip Technology's MT8870DS1 price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
