Microchip Technology MCP73213-A6SI/MF
MCP73213-A6SI/MF
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Microchip Technology MCP73213-A6SI/MF information
Type
Parameter
Factory Lead Time
14 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
10-VFDFN Exposed Pad
Number of Pins
10
Operating Temperature
-40°C~85°C TA
Packaging
Tube
Published
2009
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
10
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn) - annealed
Voltage - Rated
8.85V
Subcategory
Power Management Circuits
Terminal Position
DUAL
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
9.4V
Terminal Pitch
0.5mm
Reflow Temperature-Max (s)
40
Base Part Number
MCP73213
Pin Count
10
Output Voltage
8.4V
Max Output Current
1.1A
Power Supplies
4/16V
Number of Channels
2
Max Supply Voltage
13V
Min Supply Voltage
4.2V
Analog IC - Other Type
POWER SUPPLY SUPPORT CIRCUIT
Operating Supply Current
700μA
Adjustable Threshold
YES
Max Output Voltage
8.85V
Max Input Voltage
18V
Supply Current-Max (Isup)
1.5mA
Nominal Input Voltage
4V
Min Output Voltage
8.15V
Fault Protection
Over Voltage
Battery Chemistry
Lithium Ion/Polymer
Number of Cells
2
Drain to Source Resistance
350mOhm
Current - Charging
Constant - Programmable
Height
939.8μm
Length
2.9972mm
Width
2.9972mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
microchip-dsc1123ci5400000-conflictmineralstatement-4089.pdf
MCP73213-A6SI/MF Overview
The package Tube contains it, and you can find it there.Among the packages that come with this product, there is one that is 10-VFDFN Exposed Pad.In this case, the device has a mounting type of Surface Mount.It is recommended that the temperature be set to -40°C~85°C TA in order to ensure reliable performance.Using an analog IC of type POWER SUPPLY SUPPORT CIRCUIT, this device is able to communicate with the outside world.For the device to be charged, there is Constant - Programmable current required.The base part number MCP73213 represents its related parts.It contains 10 terminations, so that is how many there are.In total, it has 10 pins.The operation?are 10 pins.Currently, there are 2 available channels.It should be possible to run it from a 9.4V battery it should be able to run at all times.With a 13V supply voltage, it is capable of withstanding the operation of the device.Using a 8.4V output voltage results in high efficiency.There is a subcategory of Power Management Circuits for this device.A supply voltage of 4.2V is suitable for it, because it can operate with a low supply voltage.In order to mount it, it has to align itself with Surface Mount.It is configured to be 1.5mA for Vsup (maximum supply voltage).The part's power supply is set to a value of 4/16V.Its supply carries 700μA current.18V is the maximum input voltage it can handle.In order for the operation to be carried out successfully, a maximum output supply voltage of 8.85V is required.There is a reduction in the maximum output current during operation to 1.1A.
MCP73213-A6SI/MF Features
2 channels
Power Management Circuits subcategory
10-VFDFN Exposed Pad package
MCP73213-A6SI/MF Applications
There are a lot of Microchip Technology MCP73213-A6SI/MF Battery Chargers ICs applications.
- Energy harvesting
- Electric lift car
- Ruggedized notebooks/tablet computers
- Smart speakers
- Material handling
- Electric pallet truck
- Embedded automotive applications
- Power tools
- Portable speaker systems
- MP3, MP4 player
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of CellsMax Output VoltageMin Output VoltageOutput VoltageMax Output CurrentMin Supply VoltageSupply VoltageView Compare
MCP73213-A6SI/MF
Microchip Technology10-VFDFN Exposed Pad
10
2
8.85 V
8.15 V
8.4 V
1.1 A
4.2 V
9.4 V
- MCP73123-22SI/MFMicrochip Technology
10-VFDFN Exposed Pad
10
1
3.618 V
3.582 V
3.6 V
1.1 A
4.2 V
4.6 V
MCP73213-A6SI/MF
VS
MCP73123-22SI/MF
- MCP73113-06SI/MFMicrochip Technology
10-VFDFN Exposed Pad
10
1
4.221 V
4.079 V
4.2 V
1.1 A
4.2 V
5.1 V
MCP73213-A6SI/MF
VS
MCP73113-06SI/MF
- MCP73223-C2SI/MFMicrochip Technology
10-VFDFN Exposed Pad
10
1 ~ 2
7.243 V
7.157 V
7.2 V
1.1 A
4.2 V
4.6 V
MCP73213-A6SI/MF
VS
MCP73223-C2SI/MF
LTC4002EDD-8.4#PBFLinear Technology/Analog Devices10-WFDFN Exposed Pad
10
2
-
-
8.4 V
-
8.9 V
-
MCP73213-A6SI/MF
VS
LTC4002EDD-8.4#PBF
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
