Lattice Semiconductor Corporation ISPPAC-POWR1220AT8-01TN100I
ISPPAC-POWR1220AT8-01TN100I
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Lattice Semiconductor Corporation ISPPAC-POWR1220AT8-01TN100I information
Type
Parameter
Factory Lead Time
8 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
100-LQFP
Number of Pins
100
Operating Temperature
-40°C~85°C
Packaging
Tray
Published
2000
Series
ispPAC®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
100
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Applications
Power Supply Monitor, Sequencer
HTS Code
8542.39.00.01
Subcategory
Power Management Circuits
Technology
CMOS
Voltage - Supply
2.8V~3.96V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
0.5mm
Frequency
25MHz
Reflow Temperature-Max (s)
40
Base Part Number
ISPPAC-POWR1220AT8
Pin Count
100
Supply Voltage-Max (Vsup)
3.96V
Power Supplies
2.5/53/3.3V
Supply Voltage-Min (Vsup)
2.8V
Number of Channels
12
Analog IC - Other Type
POWER SUPPLY SUPPORT CIRCUIT
Operating Supply Current
40mA
Voltage - Input
-0.3V~5.9V
Nominal Supply Current
40mA
Adjustable Threshold
YES
Watchdog Timer
No
Number of Voltages Monitored
12
Threshold Voltage
75mV
Height Seated (Max)
1.6mm
Length
14mm
Width
14mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Design/Specification :
- PCN Packaging :
- ConflictMineralStatement :
ISPPAC-POWR1220AT8-01TN100I Overview
In Tray, it is packaged. In order to save space, it is included in the 100-LQFP package. It is mounted in the same way as Surface Mount. It is recommended to keep the temperature at -40°C~85°C when the machine is operating. Its exceptional performance makes it an excellent choice for Power Supply Monitor, Sequencer. High efficiency can be achieved thanks to the 2.8V~3.96V supply voltage. An analog IC is used in this device, which is set to POWER SUPPLY SUPPORT CIRCUIT in this case. There are a total of 100 terminations associated with it. It reaches a maximum temperature of 260. The device has 100 pins in total. Identifiable components can be found by using a base part number of ISPPAC-POWR1220AT8. It is possible to obtain high efficiency thanks to the 3.3V supply voltage. The possibility of accessing 12 channels exists. A device such as this is part of Power Management Circuits. It is important to keep the supply voltage (Vsup) above 2.8V for normal operation. 100 pins are used in its design. Vsup (maximum supply voltage) is set to 3.96V. The DC DC switching regulator is powered by a supply current of 40mA. Using the Surface Mount method, it is mounted. Energy is obtained from sources of 2.5/53/3.3V. Input voltage is set to -0.3V~5.9V. The ispPAC? series includes this electrical component.
ISPPAC-POWR1220AT8-01TN100I Features
100-LQFP package
Mounting type of Surface Mount
Power Management Circuits subcategory
ISPPAC-POWR1220AT8-01TN100I Applications
There are a lot of Lattice Semiconductor Corporation ISPPAC-POWR1220AT8-01TN100I Power Supply Control ICs applications.
- Computer modem power supply
- Report meeting
- Notebook
- Portable data logger
- Screen lift
- Automobile industry
- Base station power
- Electric screen
- Power factor correction
- Telecommunications
- ImagePart NumberManufacturerPackage / CaseNumber of PinsSupply VoltageTechnology[email protected] Reflow Temperature-Max (s)Lead FreeMounting TypePackagingView Compare
ISPPAC-POWR1220AT8-01TN100I
Lattice Semiconductor Corporation100-LQFP
100
3.3 V
CMOS
40
Lead Free
Surface Mount
Tray
- PIC18F97J60-I/PFMicrochip Technology
100-TQFP
100
2.5 V
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40
Lead Free
Surface Mount
Tray
ISPPAC-POWR1220AT8-01TN100I
VS
PIC18F97J60-I/PF
- PIC32MX575F256L-80I/PTMicrochip Technology
100-TQFP
100
3.3 V
CMOS
40
Lead Free
Surface Mount
Tray
ISPPAC-POWR1220AT8-01TN100I
VS
PIC32MX575F256L-80I/PT
- PIC32MX795F512L-80I/PTMicrochip Technology
100-TQFP
100
3.3 V
CMOS
40
Lead Free
Surface Mount
Tray
ISPPAC-POWR1220AT8-01TN100I
VS
PIC32MX795F512L-80I/PT
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2.Are the Lattice Semiconductor's ISPPAC-POWR1220AT8-01TN100I price and stock displayed on the website accurate?
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
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How to pack electronic components in cartons?
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3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.