Infineon Technologies IRF7306TRPBF
IRF7306TRPBF
In Stock:94131
Qty
Unit Price
Ext Price
1
$0.850000
$0.850000
10
$0.800000
$8.000000
100
$0.754700
$75.470000
500
$0.712000
$356.000000
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Infineon Technologies IRF7306TRPBF information
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1997
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
100mOhm
Additional Feature
ULTRA LOW RESISTANCE
Voltage - Rated DC
-30V
Max Power Dissipation
2W
Terminal Form
GULL WING
Current Rating
-3.6A
Base Part Number
IRF7306PBF
Number of Elements
2
Row Spacing
6.3 mm
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
Turn On Delay Time
11 ns
FET Type
2 P-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
100m Ω @ 1.8A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
440pF @ 25V
Current - Continuous Drain (Id) @ 25°C
3.6A
Gate Charge (Qg) (Max) @ Vgs
25nC @ 10V
Rise Time
17ns
Drain to Source Voltage (Vdss)
30V
Fall Time (Typ)
18 ns
Turn-Off Delay Time
25 ns
Continuous Drain Current (ID)
-3.6A
Threshold Voltage
-1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
-30V
Pulsed Drain Current-Max (IDM)
14A
FET Technology
METAL-OXIDE SEMICONDUCTOR
Recovery Time
80 ns
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Nominal Vgs
-1 V
Height
1.75mm
Length
4.9784mm
Width
4.05mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- Other Related Documents :
- PCN Assembly/Origin :
- PCN Packaging :
- ConflictMineralStatement :
IRF7306TRPBF Description
The fifth generation HEXFET of the International Rectifier Company adopts advanced processing technology to achieve the lowest possible switch. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient device that can be used in a variety of applications.
The SO-8 has been modified through a custom lead frame to enhance its thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of power applications. Multiple devices can be used in one application, greatly reducing the circuit board space. The package is designed for the vapor phase. Infrared wave soldering technology. In typical printed circuit board installation applications, it is possible to consume more than 0.8W.
IRF7306TRPBF Features
Generation V Technology
Ultra Low On-Resistance
Dual P-Channel Mosfet
Surface Mount
Available in Tape &Reel
Dynamic dv/dt Rating
Fast Switching
Lead-Free
IRF7306TRPBF Applications
HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient device that can be used in a variety of applications.
- ImagePart NumberManufacturerMountPackage / CaseDrain to Source Voltage (Vdss)Continuous Drain Current (ID)Current - Continuous Drain (Id) @ 25°CThreshold VoltageGate to Source Voltage (Vgs)Max Power DissipationView Compare
IRF7306TRPBF
Infineon TechnologiesSurface Mount
8-SOIC (0.154, 3.90mm Width)
30V
-3.6 A
3.6A
-1 V
20 V
2 W
NTMD4184PFR2GON SemiconductorSurface Mount
8-SOIC (0.154, 3.90mm Width)
30V
2.3 A
2.3A (Ta)
-
20 V
-
IRF7306TRPBF
VS
NTMD4184PFR2G
NDS9952AON SemiconductorSurface Mount
8-SOIC (0.154, 3.90mm Width)
-
3.7 A
3.7A, 2.9A
1.7 V
20 V
900 mW
IRF7306TRPBF
VS
NDS9952A
- IRF7326D2TRPBFInfineon Technologies
Surface Mount
8-SOIC (0.154, 3.90mm Width)
30V
-3.6 A
3.6A (Ta)
-
20 V
-
IRF7306TRPBF
VS
IRF7326D2TRPBF
Aztec Electronics's Payment Terms
Aztec Electronics offers many types of payment options, and support in multiple currencies such as GBP, US dollars, RMB, etc. As relationships are built, payment plans can be established so that payments can be made on a predetermined time frame after receipt of the invoice.
T/T IN ADVANCE (Pay at time of order placement via wire transfer)
How to Ship Electronic Components?
We take great care when shipping electronics overseas. Both the U.S. and U.K. governments have imposed restrictions on air transport of electronics, according to the International Air Transport Association.
1. Understand the shipping rules of the destination country
Different countries have different regulations for shipping electronic equipment, check for certain certifications, and read the destination country's guidelines before shipping to prevent delays or confiscation of goods by customs.
2. Choose a reliable express logistics provider
From providing pick-up service to checking the status with real-time order number, conveniently track packages. At present, the logistics providers we cooperate with more include DHL, UPS, Fedex, TXT.
Of course, if you have a long-term cooperative freight forwarder or your own company's logistics account, you can pick up the goods directly from our warehouse
3. How much does it cost to ship the electronic components?
The shipping cost of electronic products depends on the size and weight of the package and the shipping distance. You can first ask us about the size/weight of the products we sell to estimate the shipping cost.
4. How long does it take to ship the electronic components?
If electronic component in stock, it is usually shipped before 5 o'clock on the same day, and it usually takes 5-10 working days to complete it by international express.
If it is a scheduled component, it needs to wait for the arrival of the parts, and then it will be inspected before delivery. If there are special circumstances, the sales staff will confirm with you. Weekends and holidays will also affect the delivery time of electronic products.
1. We provide 365 days warranty for all electronic components.
2. If you need a test report, please let us know. We have a long-term cooperative testing laboratory. If you have familiar testing laboratory, we can also ship to your designated laboratory for testing.
3. Where does Aztec Electronics mainly purchase electronic components from?
Distributors, free market, 48 global large-scale OEM factories in close contact with us (Great Price advantage, 100% original)
2.Are the Infineon Technologies's IRF7306TRPBF price and stock displayed on the website accurate?
Aztec Electronics inventory fluctuates greatly and cannot be updated in time, it is recommended to confirm the order with Aztec Electronics salesperson or online customer service before payment.
You Also Ask
- How to test electronic components and quality inspections?
- How to transport your electronic components safely?
Need Any Service, please feel free contact us.
After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
1. Choose the right box for your electronic components2. Use anti-static bubble film protect electronic component
3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
