Texas Instruments LM3401MM/NOPB
LM3401MM/NOPB
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Texas Instruments LM3401MM/NOPB information
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Number of Pins
8
Operating Temperature
-40°C~125°C TJ
Packaging
Tape & Reel (TR)
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Termination
SMD/SMT
ECCN Code
EAR99
Type
DC DC Controller
Subcategory
Display Drivers
Max Power Dissipation
660mW
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
24V
Terminal Pitch
0.65mm
Base Part Number
LM3401
Number of Outputs
1
Output Voltage
35V
Max Output Current
1A
Power Supplies
24V
Max Supply Voltage
35V
Min Supply Voltage
4.5V
Power Dissipation
660mW
Output Current
1A
Max Supply Current
1.05mA
Quiescent Current
1.05mA
Topology
Step-Down (Buck)
Min Input Voltage
4.5V
Max Input Voltage
35V
Output Characteristics
CONSTANT-CURRENT
Input Characteristics
STANDARD
Internal Switch(s)
No
High Level Output Current
20μA
Low Level Output Current
5.5μA
Dimming
PWM
Number of Segments
1
Switching Frequency
1.5MHz
Multiplexed Display Capability
NO
Height
1.07mm
Length
3mm
Width
3mm
Thickness
970μm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
- Datasheets :
- PCN Assembly/Origin :
- PCN Other :
LM3401MM/NOPB Overview
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) package saves space on the board. There are 1 outputs used for the design of this LED drivers.As a mounting method, Surface Mount is used.This emerges as a DC DC Controller with high efficiency and reliability.The LED driver is capable of operating at a temperature of -40°C~125°C TJ.The system operates with a termination of 0.It is configured with 8 pins as its base.We estimate that there are 1 segments.The device has been mounted on the Surface Mount.Under the base part number LM3401, you will find this LED driver.35V is a reasonable voltage.According to its characteristics, it is also categorized into Display Drivers.As its minimal input voltage, it operates at a voltage of 4.5V.To meet the highest efficiency standards, it can be operated with a minimum supply voltage of 4.5V.The allowable maximum value of supply current reaches 35V.As long as the supply current is less than 1.05mA, this device can provide high efficiency.You can supply 1A current to the load.The electronic component can function fully when the switching frequency is maintained at 1.5MHz.LED drivers deliver all their benefits with a maximum output current of 1A.In the absence of external factors, 1.05mA current is consumed.Currently, it is generating 35V voltage.
LM3401MM/NOPB Features
Available in the 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) package
Operating temperature of -40°C~125°C TJ
Supply voltage of 24V
Switching frequency of 1.5MHz
Output voltage of 35V
LM3401MM/NOPB Applications
There are a lot of Texas Instruments LM3401MM/NOPB LED Driver ICs applications.
- LED Lighting PFCs, Linear Dimmable
- LED headlights
- Stage and Studio lighting
- Gallery lighting
- Ultraviolet (UV) and Infrared (IR) Irradiation Devices
- Other Electronic Devices
- Replacement lamps
- Dimmable LED for vehicle interiors
- Flicker-free LED Lighting using R1580N
- Architectural lighting
- ImagePart NumberManufacturerPackage / CaseNumber of PinsNumber of OutputsMin Input VoltageMax Input VoltageMax Output CurrentOutput CurrentOutput VoltageView Compare
LM3401MM/NOPB
NA8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
8
1
4.5 V
35 V
1 A
1 A
35 V
- TPS92512DGQTNA
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
10
1
4.5 V
42 V
2.5 A
2.5 A
-
LM3401MM/NOPB
VS
TPS92512DGQT
- LM3407MY/NOPBNA
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
8
1
4.5 V
30 V
350 mA
350 mA
27 V
LM3401MM/NOPB
VS
LM3407MY/NOPB
- LM3407MYX/NOPBNA
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
8
1
4.5 V
30 V
350 mA
350 mA
27 V
LM3401MM/NOPB
VS
LM3407MYX/NOPB
- AL8807BMP-13Diodes Incorporated
8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
8
1
6 V
36 V
1.3 A
1.3 A
-
LM3401MM/NOPB
VS
AL8807BMP-13
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After the electronic components have passed the quality inspection of Aztec Electronics, there are generally the following five packaging forms for electronic components: Tape, Tube, Tray, Bulk and Ammo.
Tape/Reel | Tube | Tray | Bulk | Ammo |
Weave bulk chips into tapes and pack them into reels through SMD components packaging Tape Machine. Reel is the most commonly used. | When packaging, arrange the components in the same direction and put them into plastic tubes one at a time. | Choose tray package with the same specifications as the original manufacturer, put the components into the tray and use the strapping machine. | Bulk packaging means that the SMD components are freely packaged in a formed plastic box or bag. | Adhesive tape cut continuously in predetermined quantities. The cut strips are placed in boxes for safekeeping. |
Choose electronic components that are vacuum-sealed against water, dust, moisture, oxidation, corrosion, and even UV or RF pollution.
How to pack electronic components in cartons?
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3. Put it into the box, no buffer dead corner, 360-degree package.
4. Labeled as fragile to ensure that the courier knows what needs to be done with the package.
Texas Instruments Incorporated (TI) was founded in 1930 and is headquartered in Dallas, Texas, USA. Haviv Ilan is the President and CEO. They design, manufacture, test and sell analog and embedded semiconductors. Industrial and automotive markets are the best markets for their products .
The company focuses on amplifiers, audio, clock and timing, data converters, die and wafer services, DLP® products, interfaces, isolation devices, logic, microcontrollers (MCUs) and processors, motor drivers, power management, radio frequency & Microwaves, Sensors, Switches & Multiplexers, Wireless Connectivity.
Their values: Trustworthy, Inclusive, Innovative, Competitive, Results-oriented
Acquisition history:
In October 1999, TI acquired power Trends
In 2000, TI acquired Burr Brown (BB) at approximately $7.6 billion.
In September 2011, TI acquired National semiconductor(NS.NSC) for US$6.5 billion.
In 2021, TI acquired an operational 300mm fabrication plant located in Lehi, Utah from Micron for $900 million.
Main application fields:
Automotive, Communications Equipment, Enterprise Systems, Industrial Applications, Aerospace and Defense, Appliances, Building Automation, Factory Automation and Control, Grid Infrastructure, Industrial Transportation (non-automotive and non-light truck), Lighting, Medical, Motor Drives, Power Delivery, Pro Audio, Video & Signage, Retail Automation & Payments, Test & Measurement, Personal Electronics.